公开(公告)号：US20120118628A1

公开(公告)日：2012-05-17

申请号：US12944671

申请日：2010-11-11

申请人： David Pakula ,  Stephen Brian Lynch ,  Richard Hung Minh Dinh ,  Tang Tew Tan ,  Lee Hua Tan

发明人： David Pakula ,  Stephen Brian Lynch ,  Richard Hung Minh Dinh ,  Tang Tew Tan ,  Lee Hua Tan

IPC分类号： H05K5/00 ,  B32B37/12 ,  B29C65/52 ,  B32B37/24

CPC分类号： H05K5/03 ,  A45C11/00 ,  A45F5/00 ,  G06F1/1626 ,  G06F1/1656 ,  G06F3/041 ,  H04M1/0249 ,  H04M1/0266 ,  H05K5/0017

摘要： An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

摘要翻译： 公开了一种电子设备，其具有由至少一个玻璃盖和邻近玻璃盖周边形成的外围结构形成的外壳。 周边结构可以用粘合剂固定在玻璃盖附近。 外围结构可以在玻璃盖附近模制，从而在外围结构和玻璃罩周边之间形成无间隙的界面。 在一个实施例中，外围结构至少包括内周结构和外周结构。

公开(公告)号：US20110215685A1

公开(公告)日：2011-09-08

申请号：US12895822

申请日：2010-09-30

申请人： Daniel W. Jarvis ,  Stephen Paul Zadesky ,  Pinida Jan Moolsintong ,  Tang Tew Tan

发明人： Daniel W. Jarvis ,  Stephen Paul Zadesky ,  Pinida Jan Moolsintong ,  Tang Tew Tan

IPC分类号： H05K5/02 ,  B32B37/16

CPC分类号： H05K5/0208 ,  B32B37/16 ,  H05K5/0017 ,  H05K5/02 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49158

摘要： Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

摘要翻译： 公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。 一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。 薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。 在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。 衬底层可以例如由聚合物或金属形成。 所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。