Invention Application
- Patent Title: COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
- Patent Title (中): 金属镀层组合物，用于无电离子特征填充的包含抑制剂
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Application No.: US13384732Application Date: 2010-07-19
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Publication No.: US20120118750A1Publication Date: 2012-05-17
- Inventor: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Dieter Mayer , Alexandra Haag , Charlotte Emnet
- Applicant: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Dieter Mayer , Alexandra Haag , Charlotte Emnet
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- International Application: PCT/EP2010/060375 WO 20100719
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/02
Abstract:
A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a poly-hydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.
Public/Granted literature
- US09617647B2 Composition for metal plating comprising suppressing agent for void free submicron feature filling Public/Granted day:2017-04-11
Information query
