Invention Application
- Patent Title: HOUSING OF A TEMPERATURE SENSOR, ESPECIALLY OF A THERMAL FLOW MEASURING DEVICE
- Patent Title (中): 温度传感器的外壳,特别是热流量测量装置
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Application No.: US13301904Application Date: 2011-11-22
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Publication No.: US20120125093A1Publication Date: 2012-05-24
- Inventor: Axel Pfau , Torsten Iselt , Dirk Boguhn
- Applicant: Axel Pfau , Torsten Iselt , Dirk Boguhn
- Applicant Address: CH Reinach
- Assignee: Endress + Hauser Flowtec AG
- Current Assignee: Endress + Hauser Flowtec AG
- Current Assignee Address: CH Reinach
- Priority: DE102010061731.8 20101122
- Main IPC: G01F1/68
- IPC: G01F1/68 ; B23K26/00 ; B65D85/38

Abstract:
A thermal flow measuring device and method for the manufacture of a thermal flow measuring device with a housing, which has at least one shell. A temperature sensor element is arranged in the shell which borders the housing. Each first point of an edge terminating the outside of the shell in the region of a second end section of the shell has a distance to the longitudinal axis of the shell, which is at least 0.2 mm greater than the distance of all second points of the outside of the shell to the longitudinal axis of the shell, with a first point of the edge, in each case, having a distance projected on the longitudinal axis of the shell from the first point of the edge of at least 0.2 mm in the direction of the first end section of the shell.
Public/Granted literature
- US08899830B2 Housing of a temperature sensor, especially of a thermal flow measuring device Public/Granted day:2014-12-02
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