Invention Application
- Patent Title: Method and Apparatus for Removing Contaminants from Substrate
- Patent Title (中): 从基材去除污染物的方法和装置
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Application No.: US13115649Application Date: 2011-05-25
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Publication No.: US20120125375A1Publication Date: 2012-05-24
- Inventor: Ji Zhu , Arjun Mendiratta , David Mui
- Applicant: Ji Zhu , Arjun Mendiratta , David Mui
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Main IPC: B08B3/08
- IPC: B08B3/08 ; B08B3/02 ; B08B3/00

Abstract:
A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
Public/Granted literature
- US08758522B2 Method and apparatus for removing contaminants from substrate Public/Granted day:2014-06-24
Information query
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