The invention relates to a method for smoothing out the skin by filling in recessed portions of the skin, said method comprising filling the recessed portions by means of a filling-in product which has an elastic modulus of greater than 20 000 Pascals at 25° C. for a stress frequency of 1 Hertz, a flow point of greater than 500 Pascals, and, for applied stresses of less than the yield stress, a viscosity of greater than 100000 Pa.s, the product being such that, once applied in said recessed portions of the skin, its mechanical properties change subsequent to a reaction other than an evaporation reaction or a laser polymerization re action.