发明申请
- 专利标题： ELECTRONIC COMPONENT ALIGNING DEVICE, ELECTRONIC COMPONENT PACKAGING BODY, AND ELECTRONIC COMPONENT MOUNTING BOARD.
- 专利标题（中）： 电子元件对准装置，电子元件包装体和电子元件安装板。
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申请号： US13309263申请日： 2011-12-01
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公开(公告)号： US20120138350A1公开(公告)日： 2012-06-07
- 发明人: Pum San CHAE , Doo Young KIM , Kang Heon HUR , Hong Yeon CHO
- 申请人： Pum San CHAE , Doo Young KIM , Kang Heon HUR , Hong Yeon CHO
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2010-0122304 20101202
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; H05K13/04 ; B65G47/24
摘要：
There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which the magnetic field and magnetic resistance are reduced.