发明申请
US20120138868A1 CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER
审中-公开
使用电路连接材料的电路连接材料,薄膜电路连接材料,连接电路部件的结构以及连接电路部件的方法
- 专利标题: CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER
- 专利标题(中): 使用电路连接材料的电路连接材料,薄膜电路连接材料,连接电路部件的结构以及连接电路部件的方法
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申请号: US13266906申请日: 2010-04-22
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公开(公告)号: US20120138868A1公开(公告)日: 2012-06-07
- 发明人: Motohiro Arifuku , Kouji Kobayashi , Tohru Fujinawa
- 申请人: Motohiro Arifuku , Kouji Kobayashi , Tohru Fujinawa
- 申请人地址: JP Tokyo
- 专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-109102 20090428
- 国际申请: PCT/JP2010/057165 WO 20100422
- 主分类号: H01B1/22
- IPC分类号: H01B1/22 ; H01B1/24 ; H01R43/00 ; H01B1/20 ; B82Y30/00
摘要:
The circuit connecting material of the invention is situated between mutually opposing circuit electrodes, and provides electrical connection between the electrodes in the pressing direction when the mutually opposing circuit electrodes are pressed, the circuit connecting material comprising anisotropic conductive particles wherein conductive fine particles are dispersed in an organic insulating material.
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