Invention Application
- Patent Title: RUN-FLAT TIRE
- Patent Title (中): 跑平轮胎
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Application No.: US13391209Application Date: 2010-07-21
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Publication No.: US20120145299A1Publication Date: 2012-06-14
- Inventor: Hidehiko Hino , Masahiro Hanya
- Applicant: Hidehiko Hino , Masahiro Hanya
- Priority: JP2009-191249 20090820
- International Application: PCT/JP2010/062241 WO 20100721
- Main IPC: B60C17/00
- IPC: B60C17/00

Abstract:
Disclosed is a run-flat tire having greatly increased run-flat endurance. The disclosed run-flat tire is provided with: a carcass (6) extending from a tread section (2) through a sidewall portion (3) to a bead core (5) of a bead portion (4); and a side-reinforcement rubber layer (9) that has a crescent-shaped cross-section and is disposed inside the carcass (6) in the sidewall portion (3). A heat-conducting rubber (11) having a coefficient of thermal conductivity of not less than 0.3 W/(m·K) is disposed on the inner cavity surface (12) of the tire. At least part of said heat-conducting rubber (11) is disposed in a side-reinforcement rubber layer projection area (T) where the side-reinforcement rubber layer (9) is projected onto the inner cavity surface (12) of the tire.
Information query