Invention Application
US20120145299A1 RUN-FLAT TIRE 审中-公开
跑平轮胎

  • Patent Title: RUN-FLAT TIRE
  • Patent Title (中): 跑平轮胎
  • Application No.: US13391209
    Application Date: 2010-07-21
  • Publication No.: US20120145299A1
    Publication Date: 2012-06-14
  • Inventor: Hidehiko HinoMasahiro Hanya
  • Applicant: Hidehiko HinoMasahiro Hanya
  • Priority: JP2009-191249 20090820
  • International Application: PCT/JP2010/062241 WO 20100721
  • Main IPC: B60C17/00
  • IPC: B60C17/00
RUN-FLAT TIRE
Abstract:
Disclosed is a run-flat tire having greatly increased run-flat endurance. The disclosed run-flat tire is provided with: a carcass (6) extending from a tread section (2) through a sidewall portion (3) to a bead core (5) of a bead portion (4); and a side-reinforcement rubber layer (9) that has a crescent-shaped cross-section and is disposed inside the carcass (6) in the sidewall portion (3). A heat-conducting rubber (11) having a coefficient of thermal conductivity of not less than 0.3 W/(m·K) is disposed on the inner cavity surface (12) of the tire. At least part of said heat-conducting rubber (11) is disposed in a side-reinforcement rubber layer projection area (T) where the side-reinforcement rubber layer (9) is projected onto the inner cavity surface (12) of the tire.
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