Invention Application
- Patent Title: LOWER LINER WITH INTEGRATED FLOW EQUALIZER AND IMPROVED CONDUCTANCE
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Application No.: US13401572Application Date: 2012-02-21
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Publication No.: US20120145326A1Publication Date: 2012-06-14
- Inventor: James D. CARDUCCI , Andrew NGUYEN , Ajit BALAKRISHNA , Michael C. KUTNEY
- Applicant: James D. CARDUCCI , Andrew NGUYEN , Ajit BALAKRISHNA , Michael C. KUTNEY
- Main IPC: H05H1/24
- IPC: H05H1/24 ; B44C1/22
Abstract:
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.
Public/Granted literature
- US08282736B2 Lower liner with integrated flow equalizer and improved conductance Public/Granted day:2012-10-09
Information query
IPC分类:
