Invention Application
- Patent Title: Radio-Frequency Packaging with Reduced RF Loss
- Patent Title (中): 降低射频损耗的射频封装
-
Application No.: US12965402Application Date: 2010-12-10
-
Publication No.: US20120147578A1Publication Date: 2012-06-14
- Inventor: Jun-De Jin , Mei-Show Chen , Tzu-Jin Yeh
- Applicant: Jun-De Jin , Mei-Show Chen , Tzu-Jin Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02
Abstract:
A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.
Public/Granted literature
- US08773866B2 Radio-frequency packaging with reduced RF loss Public/Granted day:2014-07-08
Information query
