发明申请
- 专利标题： SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- 专利标题（中）： 具有铜插头的半导体器件
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申请号： US13418261申请日： 2012-03-12
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公开(公告)号： US20120168952A1公开(公告)日： 2012-07-05
- 发明人: Mukta G. Farooq , Emily R. Kinser , Ian D. Melville , Krystyna W. Semkow
- 申请人： Mukta G. Farooq , Emily R. Kinser , Ian D. Melville , Krystyna W. Semkow
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/768
摘要：
Disclosed is a process of making a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. There may also be a cap layer over the copper plug to protect it from oxidation. There may also be a dielectric layer over the cap layer.
公开/授权文献
- US08749059B2 Semiconductor device having a copper plug 公开/授权日：2014-06-10
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