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45 条记录 (耗时 0.028 秒)

    Multi-anode system for uniform plating of alloys
    5.
    发明授权
    Multi-anode system for uniform plating of alloys 失效
    用于均匀电镀合金的多阳极系统

    公开(公告)号：US08551303B2

    公开(公告)日：2013-10-08

    申请号：US13406679

    申请日：2012-02-28

    申请人： Charles L. Arvin ,  Raschid J. Bezama ,  Harry D. Cox ,  Krystyna W. Semkow

    发明人： Charles L. Arvin ,  Raschid J. Bezama ,  Harry D. Cox ,  Krystyna W. Semkow

    IPC分类号： C25B9/00 ,  C25B9/06

    CPC分类号： C25D17/008 ,  C25D17/007 ,  C25D17/12

    摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

    摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

    Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating
    8.
    发明授权
    Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating 失效
    在非金属或半导体层上进行金属化学镀无电镀

    公开(公告)号：US5846598A

    公开(公告)日：1998-12-08

    申请号：US815337

    申请日：1997-03-11

    申请人： Krystyna W. Semkow ,  Eugene J. O'Sullivan

    发明人： Krystyna W. Semkow ,  Eugene J. O'Sullivan

    IPC分类号： C23C18/16 ,  C23C18/36 ,  H01L21/288 ,  H01L21/48 ,  H01L21/768 ,  B05D5/12

    CPC分类号： H01L21/288 ,  C23C18/161 ,  C23C18/165 ,  C23C18/36 ,  H01L21/4846 ,  H01L21/76838

    摘要： In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, corrosion protection is provided by plating those features by electroless deposition of a nickel-phosphorus alloy forming a layer having a thickness in a range from about 200 .ANG. to about 3000 .ANG., at a rate of about 100 .ANG. per minute, in an aqueous plating bath comprising nickel sulfate hexahydrate in an amount of about 5.5 grams per liter, sodium hypophosphite in an amount of about six grams per liter, boric acid in an amount of about 30 grams per liter, sodium citrate in an amount of about 45 grams per liter, lead acetate in an amount of about one part per million by weight of lead, and a surfactant in an amount of about 0.1 grams per liter. The bath has a temperature of about 72.degree. C. and a pH of about 8.1. The gaps having widths of at least one micron remain essentially free of extraneous plating.

    摘要翻译： 在制造具有在聚酰亚胺层上具有金属特征的微电子部件时，金属特征通过间隙彼此间隔开，其中至少一些间隙的宽度在约1微米至约500微米的范围内，提供了腐蚀保护 通过在包含硫酸镍六水合物的水性电镀浴中以约100安格姆每分钟的速率无电沉积形成厚度在约200安培姆至约3000安培的层的镍 - 磷合金进行电镀这些特征 约5.5克/升的次磷酸钠，每升约6克的次磷酸钠，硼酸的量为约30克/升，柠檬酸钠的量为约45克/升，乙酸铅在一 量为铅重量百万分之一份左右，表面活性剂的量为约0.1克/升。 浴的温度为约72℃，pH为约8.1。 具有至少1微米宽度的间隙基本上不含外部电镀。

    Multi-anode system for uniform plating of alloys
    9.
    发明授权
    Multi-anode system for uniform plating of alloys 失效
    用于均匀电镀合金的多阳极系统

    公开(公告)号：US08623194B2

    公开(公告)日：2014-01-07

    申请号：US13604666

    申请日：2012-09-06

    申请人： Charles L. Arvin ,  Raschid J. Bezama ,  Harry D. Cox ,  Krystyna W. Semkow

    发明人： Charles L. Arvin ,  Raschid J. Bezama ,  Harry D. Cox ,  Krystyna W. Semkow

    IPC分类号： C25D3/56

    CPC分类号： C25D17/008 ,  C25D17/007 ,  C25D17/12

    摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

    摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

    Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack
    10.
    发明授权
    Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack 有权
    使用电解Cu /电解Ni /电解铜叠层的底部衬底冶金

    公开(公告)号：US08587112B2

    公开(公告)日：2013-11-19

    申请号：US13453074

    申请日：2012-04-23

    申请人： Charles L. Arvin ,  Hai P. Longworth ,  David J. Russell ,  Krystyna W. Semkow

    发明人： Charles L. Arvin ,  Hai P. Longworth ,  David J. Russell ,  Krystyna W. Semkow

    IPC分类号： H05K3/00

    CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/24 ,  H05K3/243 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0341 ,  H05K2201/0769 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00

    摘要： An electroless Cu layer is formed on each side of a packaging substrate containing a core, at least one front metal interconnect layer, and at least one backside metal interconnect layer. A photoresist is applied on both electroless Cu layers and lithographically patterned. First electrolytic Cu portions are formed on exposed surfaces of the electroless Cu layers, followed by formation of electrolytic Ni portions and second electrolytic Cu portions. The electrolytic Ni portions provide enhanced resistance to electromigration, while the second electrolytic Cu portions provide an adhesion layer for a solder mask and serves as an oxidation protection layer. Some of the first electrolytic Cu may be masked by lithographic means to block formation of electrolytic Ni portions and second electrolytic Cu portions thereupon as needed. Optionally, the electrolytic Ni portions may be formed directly on electroless Cu layers.

    摘要翻译： 在包含芯，至少一个前金属互连层和至少一个背侧金属互连层的封装基板的每一侧上形成化学镀铜层。 在两个无电镀铜层上涂布光致抗蚀剂，并用光刻图案化。 第一电解Cu部分形成在无电解Cu层的暴露表面上，随后形成电解Ni部分和第二电解Cu部分。 电解Ni部分提供增强的电迁移阻力，而第二电解Cu部分提供用于焊接掩模的粘附层并且用作氧化保护层。 一些第一电解铜可以被光刻装置掩盖，以根据需要阻挡电解Ni部分和第二电解Cu部分的形成。 任选地，电解Ni部分可以直接形成在无电镀Cu层上。