Invention Application
US20120178849A1 RESIN POWDER CONTAINING ALUMINUM SALT, PROCESS FOR PRODUCTION OF THE SAME, AND RESIN COMPOSITION, PHOSPHORUS ADSORBENT, ANTIBACTERIAL AGENT OR ANTIFUNGAL AGENT COMPRISING THE SAME 审中-公开
含有铝盐的树脂粉末,其生产方法和树脂组合物,磷吸附剂,抗菌剂或包含它们的反真菌剂

  • Patent Title: RESIN POWDER CONTAINING ALUMINUM SALT, PROCESS FOR PRODUCTION OF THE SAME, AND RESIN COMPOSITION, PHOSPHORUS ADSORBENT, ANTIBACTERIAL AGENT OR ANTIFUNGAL AGENT COMPRISING THE SAME
  • Patent Title (中): 含有铝盐的树脂粉末,其生产方法和树脂组合物,磷吸附剂,抗菌剂或包含它们的反真菌剂
  • Application No.: US13424803
    Application Date: 2012-03-20
  • Publication No.: US20120178849A1
    Publication Date: 2012-07-12
  • Inventor: Kenji YAMASHITA
  • Applicant: Kenji YAMASHITA
  • Applicant Address: JP Osaka
  • Assignee: KANEKA CORPORATION
  • Current Assignee: KANEKA CORPORATION
  • Current Assignee Address: JP Osaka
  • Priority: JPJP2006-155365 20060602; JPJP2006-186244 20060706; JPJP2007-054689 20070305; JPJP2007-054690 20070305
  • Main IPC: A61L2/16
  • IPC: A61L2/16 B01D15/04 C09D5/14
RESIN POWDER CONTAINING ALUMINUM SALT, PROCESS FOR PRODUCTION OF THE SAME, AND RESIN COMPOSITION, PHOSPHORUS ADSORBENT, ANTIBACTERIAL AGENT OR ANTIFUNGAL AGENT COMPRISING THE SAME
Abstract:
An aluminum salt-containing resin powder of the present invention includes: at lest one matrix resin component selected from regenerated collagen, polyvinyl alcohol and carboxymethyl cellulose; and an aluminum salt. The aluminum salt is chemically bonded to the matrix resin component, and the resultant is powdered. A resin composition of the present invention includes 0.1 wt % or more and 80 wt % or less of the aluminum salt-containing resin powder and 20 wt % or more and 99.9 wt % or less of a resin other than the aluminum salt-containing resin. Thus, the present invention provides an aluminum salt-containing resin powder having a high phosphorus adsorption property a high antibacterial property and a high antifungal property, and a resin composition containing the aluminum salt-containing resin powder.
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