发明申请
US20120187281A1 LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS
有权
具有透明基板和穿透基板VIAS的光传感器
- 专利标题: LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS
- 专利标题(中): 具有透明基板和穿透基板VIAS的光传感器
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申请号: US13337864申请日: 2011-12-27
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公开(公告)号: US20120187281A1公开(公告)日: 2012-07-26
- 发明人: Nicole D. Kerness , Arkadii V. Samoilov , Zhihai Wang , Joy T. Jones
- 申请人: Nicole D. Kerness , Arkadii V. Samoilov , Zhihai Wang , Joy T. Jones
- 申请人地址: US CA Sunnyvale
- 专利权人: MAXIM INTEGRATED PRODUCTS, INC.
- 当前专利权人: MAXIM INTEGRATED PRODUCTS, INC.
- 当前专利权人地址: US CA Sunnyvale
- 主分类号: H01L31/0232
- IPC分类号: H01L31/0232 ; H01L31/18
摘要:
Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers.
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