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1.发明授权Light sensor having a contiguous IR suppression filter and a transparent substrate 有权光传感器具有连续的IR抑制滤光器和透明基板公开(公告)号：US08803068B2
公开(公告)日：2014-08-12
申请号：US13337855
申请日：2011-12-27
IPC分类号： G01J3/50
CPC分类号： H01L31/02327 , G01S17/58 , H01L27/1446 , H01L31/102 , H01L31/112 , H01L31/167 , H01L31/18
摘要： Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer.
摘要翻译： 描述了将技术描述为在光传感器的透明基板上形成的IR抑制滤波器或任何其它基于干涉的滤波器。 在一个或多个实施方式中，光传感器包括具有表面的基板。 在衬底中形成一个或多个光电检测器。 光电检测器被配置为检测光并响应于此提供信号。 构造成阻挡红外光到达表面的IR抑制滤光器形成在透明基板上。 光传感器还可以包括布置在表面上的多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。 缓冲层设置在表面上并且被配置为封装多个彩色通过滤光片和粘附层。
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2.发明申请公开(公告)号：US20120187281A1
公开(公告)日：2012-07-26
申请号：US13337864
申请日：2011-12-27
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L27/14621 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14687 , H01L31/02165 , H01L31/02327 , H01L31/18 , H01L2224/13
摘要： Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers.
摘要翻译： 描述了技术来提供在玻璃基板上形成到光传感器的IR抑制滤光器。 在一个或多个实施方式中，光传感器包括具有表面的基板。 在衬底中形成一个或多个光电检测器，并配置成检测光并响应于此提供信号。 构造成阻挡红外光到达表面的IR抑制滤光器形成在玻璃基板上。 光传感器还包括布置在表面上的多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。 缓冲层设置在表面上并且被配置为封装多个彩色通过滤光片和粘附层。 光传感器还包括穿硅通孔，以提供不同导电层之间的电互连。
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3.发明授权Light sensor having a transparent substrate, a contiguous IR suppression filter and through-substrate vias 有权光传感器具有透明基板，连续IR抑制滤光器和贯通基板通孔公开(公告)号：US08791404B2
公开(公告)日：2014-07-29
申请号：US13337864
申请日：2011-12-27
IPC分类号： G01J3/50
CPC分类号： H01L27/14621 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14687 , H01L31/02165 , H01L31/02327 , H01L31/18 , H01L2224/13
摘要： Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers.
摘要翻译： 描述了技术来提供在玻璃基板上形成到光传感器的IR抑制滤光器。 在一个或多个实施方式中，光传感器包括具有表面的基板。 在衬底中形成一个或多个光电检测器，并配置成检测光并响应于此提供信号。 构造成阻挡红外光到达表面的IR抑制滤光器形成在玻璃基板上。 光传感器还包括布置在表面上的多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。 缓冲层设置在表面上并且被配置为封装多个彩色通过滤光片和粘附层。 光传感器还包括穿硅通孔，以提供不同导电层之间的电互连。
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公开(公告)号：US08779540B2
公开(公告)日：2014-07-15
申请号：US13337879
申请日：2011-12-27
IPC分类号： H01L31/0232
CPC分类号： H01L27/14621 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14687 , H01L31/02165 , H01L31/02327 , H01L31/18 , H01L2224/13
摘要： Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured to pass light in a limited spectrum of wavelengths to the photodetector. A glass substrate is disposed over the substrate and includes a lens that is configured to collimate light incident on the lens and to pass the collimated light to the color filter.
摘要翻译： 描述了具有玻璃基板的光传感器装置，该玻璃基板包括用于将光聚焦在各种各样的角度上的结合到光传感器装置上的透镜。 在一个或多个实施方案中，光传感器装置包括其中形成有光电检测器的基板。 光电检测器能够检测光并响应于此提供信号。 传感器还包括设置在光电检测器上方的一个或多个滤色器。 滤色器被配置为将光在有限的波长范围内传递到光电检测器。 玻璃基板设置在基板上方，并且包括被配置为准直入射在透镜上的光并将准直光通过到滤色器的透镜。
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公开(公告)号：US08749007B1
公开(公告)日：2014-06-10
申请号：US13337871
申请日：2011-12-27
IPC分类号： H01L31/0232
CPC分类号： H01L27/14621 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14687 , H01L31/02165 , H01L31/02327 , H01L31/18 , H01L2224/13
摘要： A light sensor is described that includes a glass substrate having a diffuser formed therein and at least one color filter integrated on-chip (i.e., integrated on the die of the light sensor). In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a semiconductor substrate. At least one photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. The color filter is configured to filter light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to the photodetector. A glass substrate is positioned over the substrate and includes a diffuser. The diffuser is configured to diffuse light incident on the diffuser and to pass the diffused light to the at least one color filter for further filtering.
摘要翻译： 描述了一种光传感器，其包括其中形成有扩散器的玻璃基板和集成在片上（即，集成在光传感器的管芯上）的至少一个滤色器。 在一个或多个实施方案中，光传感器包括包括半导体衬底的半导体器件（例如裸片）。 至少一个光电探测器（例如，光电二极管，光电晶体管等）形成在靠近衬底表面的衬底中。 滤色器被配置为过滤由光传感器接收的光以将有限的波长（例如，具有第一波长和第二波长之间的波长的光）的光传递到光电检测器。 玻璃基板位于基板上方并且包括扩散器。 漫射器被配置为漫射入射在扩散器上的光并且将漫射光通过至少一个滤色器以进一步滤光。
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公开(公告)号：US20120187515A1
公开(公告)日：2012-07-26
申请号：US13337879
申请日：2011-12-27
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L27/14621 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14687 , H01L31/02165 , H01L31/02327 , H01L31/18 , H01L2224/13
摘要： Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured to pass light in a limited spectrum of wavelengths to the photodetector. A glass substrate is disposed over the substrate and includes a lens that is configured to collimate light incident on the lens and to pass the collimated light to the color filter.
摘要翻译： 描述了具有玻璃基板的光传感器装置，该玻璃基板包括用于将光聚焦在各种各样的角度上的结合到光传感器装置上的透镜。 在一个或多个实施方案中，光传感器装置包括其中形成有光电检测器的基板。 光电检测器能够检测光并响应于此提供信号。 传感器还包括设置在光电检测器上方的一个或多个滤色器。 滤色器被配置为将光在有限的波长范围内传递到光电检测器。 玻璃基板设置在基板上方，并且包括被配置为准直入射在透镜上的光并将准直光通过到滤色器的透镜。
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公开(公告)号：US20120187280A1
公开(公告)日：2012-07-26
申请号：US13337855
申请日：2011-12-27
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L31/02327 , G01S17/58 , H01L27/1446 , H01L31/102 , H01L31/112 , H01L31/167 , H01L31/18
摘要： Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer.
摘要翻译： 描述了将技术描述为在光传感器的透明基板上形成的IR抑制滤波器或任何其它基于干涉的滤波器。 在一个或多个实施方式中，光传感器包括具有表面的基板。 在衬底中形成一个或多个光电检测器。 光电检测器被配置为检测光并响应于此提供信号。 构造成阻挡红外光到达表面的IR抑制滤光器形成在透明基板上。 光传感器还可以包括布置在表面上的多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。 缓冲层设置在表面上并且被配置为封装多个彩色通过滤光片和粘附层。
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