发明申请
- 专利标题： SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE CLAMP APPARATUS, AND CHEMICAL LIQUID TREATMENT APPARATUS
- 专利标题（中）： 基板加工装置，基板转印装置，基板夹装置和化学液体处理装置
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申请号： US13404409申请日： 2012-02-24
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公开(公告)号： US20120193506A1公开(公告)日： 2012-08-02
- 发明人: Nobuyuki TAKAHASHI , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
- 申请人： Nobuyuki TAKAHASHI , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
- 优先权： JP2006-046002 20060222
- 主分类号： F16M11/20
- IPC分类号： F16M11/20
摘要：
The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.
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