公开(公告)号：US20090067959A1

公开(公告)日：2009-03-12

申请号：US11665963

申请日：2007-02-21

申请人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H01L21/67

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。 摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106） 抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。

公开(公告)号：US20120193506A1

公开(公告)日：2012-08-02

申请号：US13404409

申请日：2012-02-24

申请人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： F16M11/20

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理设备的抛光装置包括用于抛光半导体晶片（W）的多个抛光部分和用于传送晶片（W）的摆动传送器。 摆动传送器包括适于夹紧晶片（W）的晶片夹持机构，用于沿着抛光部分的壳体的框架垂直移动晶片夹持机构的垂直移动机构，以及用于使晶片夹紧机构摆动的摆动机构 靠近框架的轴。

公开(公告)号：US20110168214A1

公开(公告)日：2011-07-14

申请号：US13073340

申请日：2011-03-28

申请人： Hiroyuki KANEKO ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Hiroyuki KANEKO ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： B08B3/00 ,  H01L21/68

CPC分类号： H01L21/68728 ,  B24B37/345 ,  B24B41/06 ,  H01L21/67219 ,  H01L21/68707 ,  Y10S134/902 ,  Y10T29/53091 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53196

摘要： A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

摘要翻译： 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴，分别安装在主轴上的用于保持基板周边的夹紧辊，用于使至少一个夹紧辊旋转的旋转装置，至少一个基座部件 所述主轴中的至少一个被安装，以及适于允许所述基座构件旋转的旋转机构。

公开(公告)号：US07938130B2

公开(公告)日：2011-05-10

申请号：US11730309

申请日：2007-03-30

申请人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： B08B3/02

CPC分类号： H01L21/68728 ,  B24B37/345 ,  B24B41/06 ,  H01L21/67219 ,  H01L21/68707 ,  Y10S134/902 ,  Y10T29/53091 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53196

摘要： A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

摘要翻译： 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴，分别安装在主轴上的用于保持基板周边的夹紧辊，用于使至少一个夹紧辊旋转的旋转装置，至少一个基座部件 所述主轴中的至少一个被安装，以及适于允许所述基座构件旋转的旋转机构。

公开(公告)号：US20070226992A1

公开(公告)日：2007-10-04

申请号：US11730309

申请日：2007-03-30

申请人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H05K13/04 ,  B24B49/00

CPC分类号： H01L21/68728 ,  B24B37/345 ,  B24B41/06 ,  H01L21/67219 ,  H01L21/68707 ,  Y10S134/902 ,  Y10T29/53091 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53196

摘要： A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

摘要翻译： 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴，分别安装在主轴上的用于保持基板周边的夹紧辊，用于使至少一个夹紧辊旋转的旋转装置，至少一个基座部件 所述主轴中的至少一个被安装，以及适于允许所述基座构件旋转的旋转机构。

公开(公告)号：US08087419B2

公开(公告)日：2012-01-03

申请号：US13073340

申请日：2011-03-28

申请人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： B08B3/02 ,  H01L21/68

CPC分类号： H01L21/68728 ,  B24B37/345 ,  B24B41/06 ,  H01L21/67219 ,  H01L21/68707 ,  Y10S134/902 ,  Y10T29/53091 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53196

摘要： A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

摘要翻译： 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴，分别安装在主轴上的用于保持基板周边的夹紧辊，用于使至少一个夹紧辊旋转的旋转装置，至少一个基座部件 所述主轴中的至少一个被安装，以及适于允许所述基座构件旋转的旋转机构。

公开(公告)号：US08795032B2

公开(公告)日：2014-08-05

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20090305612A1

公开(公告)日：2009-12-10

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00 ,  B08B3/00 ,  B08B1/02 ,  F26B5/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20100154837A1

公开(公告)日：2010-06-24

申请号：US12654437

申请日：2009-12-18

申请人： Takahiro Ogawa ,  Naoki Matsuda ,  Koichi Fukaya ,  Hiroyuki Kaneko

发明人： Takahiro Ogawa ,  Naoki Matsuda ,  Koichi Fukaya ,  Hiroyuki Kaneko

IPC分类号： B08B3/00

CPC分类号： B08B17/00 ,  B08B3/02 ,  B08B17/025 ,  H01L21/67051 ,  H01L21/6708

摘要： A liquid-scattering prevention cup, provided in a substrate processing apparatus, is capable of attaching a hydrophilic member, such as a PVA sponge, to an inner surface of a liquid-scattering prevention cup body easily and efficiently. The liquid-scattering prevention cup includes a liquid-scattering prevention cup body, and a liquid-scattering prevention sheet having a surface hydrophilic material layer, attached to an entire area or a predetermined area of the inner surface of the liquid-scattering prevention cup body. The liquid-scattering prevention sheet has been attached to the liquid-scattering prevention cup body by an attachment such that the hydrophilic material layer is exposed.

摘要翻译： 设置在基板处理装置中的液体散射防止杯能够容易且有效地将亲水构件如PVA海绵附着到防止液体散射的杯体的内表面。 液体散射防止杯包括液体散射防止杯体和具有表面亲水材料层的液体散射防止片，附着在防止液体散射杯体的内表面的整个区域或预定区域 。 通过使亲水性材料层露出的附着物将液体散射防止片附着在防止散射液体的杯体上。

公开(公告)号：US08777198B2

公开(公告)日：2014-07-15

申请号：US13398216

申请日：2012-02-16

申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： B23Q1/00

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：基板保持件，用于通过使基板（W）的表面的周边部分与第一密封构件接触来支撑基板（W）; 以及基板按压部，其相对于基板保持件下降，以将由基板保持件保持的基板（W）向下压，从而使第一密封部件与基板（W）压力接触。 基板按压部设置有与基板保持件的环状保持部的上表面压力接触的第二环状密封部件，从而密封基板按压部的周边区域。