发明申请
- 专利标题： SEALED AIR GAP FOR SEMICONDUCTOR CHIP
- 专利标题（中）： 密封用于半导体芯片的空气隙
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申请号： US13020107申请日： 2011-02-03
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公开(公告)号： US20120199886A1公开(公告)日： 2012-08-09
- 发明人: David V. Horak , Elbert E. Huang , Charles W. Koburger, III , Douglas C. La Tulipe, JR. , Shom Ponoth
- 申请人： David V. Horak , Elbert E. Huang , Charles W. Koburger, III , Douglas C. La Tulipe, JR. , Shom Ponoth
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L29/772
- IPC分类号： H01L29/772 ; H01L21/336
摘要：
A semiconductor chip, including a substrate; a dielectric layer over the substrate; a gate within the dielectric layer, the gate including a sidewall; a source and a drain in the substrate adjacent to the gate; a tapered contact contacting a portion of one of the source or the drain; and a sealed air gap between the sidewall and the contact.
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IPC分类:
