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US20120199986A1 Semiconductor Device and Manufacturing Method Thereof 失效
半导体器件及其制造方法

Semiconductor Device and Manufacturing Method Thereof
摘要:
A wiring line is electrically connected in parallel to an auxiliary wiring line via a plurality of contact holes. The contact holes are formed through an insulating film and arranged in vertical direction to the wiring line. Since the auxiliary wiring line is formed in the same layer as an electrode that constitutes a TFT, the electric resistance of the wiring line can be reduced effectively without increasing the number of manufacturing steps.
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