An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.