公开(公告)号：US5223856A

公开(公告)日：1993-06-29

申请号：US740291

申请日：1991-08-05

申请人： Akihiro Kawata ,  Ryoichi Shiraishi ,  Shigenori Ota

发明人： Akihiro Kawata ,  Ryoichi Shiraishi ,  Shigenori Ota

IPC分类号： B41J2/335 ,  B41J2/345

CPC分类号： B41J2/3355 ,  B41J2/3357 ,  B41J2/33575 ,  B41J2/345

摘要： When the support member and cooling member of the thermal head are made of aluminum, and the head substrate is made of ceramic, the difference in the coefficient of thermal expansion of the two is very large, and the aluminum is expanded in use, and the gap to the adjacent head substrate is increased to cause white stripes. In the invention, the materials are properly selected so that the coefficient of thermal expansion of the support member and cooling member and the coefficient of thermal expansion of the head substrate may be close to each other, and the head substrate is adhered to the cooling plate with a soft adhesive. Therefore, if a difference is caused in the amount of expansion between the head substrate and the cooling plate during use, it is suppressed to such an extent as to be absorbed by the elastic deformation of the soft adhesive.

摘要翻译： 当热头的支撑构件和冷却构件由铝制成，并且头基板由陶瓷制成时，两者的热膨胀系数的差异非常大，并且铝在使用中膨胀，并且 与相邻的头基板的间隙增加以产生白色条纹。 在本发明中，适当地选择材料，使得支撑构件和冷却构件的热膨胀系数和头基板的热膨胀系数可以彼此接近，并且头基板粘附到冷却板 用柔软的粘合剂。 因此，如果在使用中头部基板和冷却板之间的膨胀量产生差异，则被抑制到被软粘合剂的弹性变形吸收的程度。

公开(公告)号：US09148948B2

公开(公告)日：2015-09-29

申请号：US13362327

申请日：2012-01-31

申请人： Ryoichi Shiraishi ,  Toru Itabashi ,  Takahiko Furuta ,  Yuuki Mikami ,  Hiroaki Nakamura ,  Shigeki Nishiyama

发明人： Ryoichi Shiraishi ,  Toru Itabashi ,  Takahiko Furuta ,  Yuuki Mikami ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC分类号： H02H5/04 ,  H05K1/02 ,  H01H85/046

CPC分类号： H05K1/0265 ,  H01H85/046 ,  H05K1/0293 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/10181

摘要： An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

摘要翻译： 电子控制装置包括基板，设置在基板上的部件安装的导线，安装在相应的部件安装导线上的电子部件，设置在基板上并与每个电子部件耦合的公共线，以及连接在 组件安装线和公共线之一。 中断线根据过电流产生的热量而熔化。 中断线包括第一线段和比第一线段短的第二线段。 第一线段和第二线段以预定角度相互耦合，该预定角度被确定为使得线段中的一个与公共线耦合，而另一个与部件安装线中的一个耦合。

公开(公告)号：US20120200973A1

公开(公告)日：2012-08-09

申请号：US13362327

申请日：2012-01-31

申请人： Ryoichi SHIRAISHI ,  Toru Itabashi ,  Takahiko Furuta ,  Yuuki Mikami ,  Hiroaki Nakamura ,  Shigeki Nishiyama

发明人： Ryoichi SHIRAISHI ,  Toru Itabashi ,  Takahiko Furuta ,  Yuuki Mikami ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC分类号： H02H5/04

CPC分类号： H05K1/0265 ,  H01H85/046 ,  H05K1/0293 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/10181

摘要： An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

摘要翻译： 电子控制装置包括基板，设置在基板上的部件安装的导线，安装在相应的部件安装导线上的电子部件，设置在基板上并与每个电子部件耦合的公共线，以及连接在 组件安装线和公共线之一。 中断线根据过电流产生的热量而熔化。 中断线包括第一线段和比第一线段短的第二线段。 第一线段和第二线段以预定角度相互耦合，该预定角度被确定为使得线段中的一个与公共线耦合，而另一个与部件安装线中的一个耦合。

公开(公告)号：US4840500A

公开(公告)日：1989-06-20

申请号：US76849

申请日：1987-07-23

申请人： Akira Sasaki ,  Yoshihito Takahashi ,  Akiyoshi Hakoyama ,  Katsumasa Mikami ,  Masafumi Suzaki ,  Takeo Honma ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi ,  Yasuo Nishiguchi

发明人： Akira Sasaki ,  Yoshihito Takahashi ,  Akiyoshi Hakoyama ,  Katsumasa Mikami ,  Masafumi Suzaki ,  Takeo Honma ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi ,  Yasuo Nishiguchi

IPC分类号： B41J2/335 ,  B41J2/345

CPC分类号： B41J2/33525 ,  B41J2/3357 ,  B41J2/345

摘要： The face pressure distribution shape of the graze portion of the thermal head is made to be consistent with the temperature distribution shape of the graze portion of the thermal head. The temperature distribution shape of the graze portion of the thermal head is made to be consistent with the face pressure distribution shape of the graze portion of the thermal head. The graze portion of the thermal head is formed projectingly in two steps, and the heating resistor element of the thermal head is provided on the top portion of the graze portion of the thermal head. A thermal transfer printer having no ink void and no ink transfer unevenness can be obtained.

摘要翻译： 使热敏头的放牧部分的面部压力分布形状与热敏头的喷射部分的温度分布形状一致。 使热头的放牧部分的温度分布形状与热敏头的喷射部分的面部压力分布形状一致。 热敏头的放牧部分两个突出地形成，热敏头的加热电阻元件设置在热敏头的喷射部分的顶部。 可以获得没有墨水空隙并且没有油墨转印不均匀的热转印打印机。

公开(公告)号：US08971006B2

公开(公告)日：2015-03-03

申请号：US13362562

申请日：2012-01-31

申请人： Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Yusuke Takahashi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

发明人： Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Yusuke Takahashi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC分类号： H01H85/08 ,  H01H85/10 ,  H02H5/04 ,  H05K1/02 ,  H01H85/046

CPC分类号： H02H5/047 ,  H01H85/046 ,  H01H85/08 ,  H01H85/10 ,  H05K1/0265 ,  H05K1/0293 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10181

摘要： An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

公开(公告)号：US20120200970A1

公开(公告)日：2012-08-09

申请号：US13362497

申请日：2012-01-31

申请人： Toru ITABASHI ,  Yuuki Mikami ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

发明人： Toru ITABASHI ,  Yuuki Mikami ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC分类号： H02H5/04

CPC分类号： H01H37/32 ,  H01H37/64 ,  H01H69/022 ,  H01H85/046 ,  H05K1/0293 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09727 ,  H05K2201/10181

摘要： An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

摘要翻译： 电子控制装置包括基板，设置在基板上的多个部件安装的线，安装在各个部件安装的导线上的多个电子部件，设置在基板上并与每个电子部件耦合的公共线， 连接在组件安装线中的一个和公共线之间的中断线，连接线，中断线通过该连接线与公共线中的一个和部件安装的线中的一个耦合，以及布置在每个之间的焊料 电子部件和相应的部件安装线中的一个并且具有比中断线更低的熔点。 中断线被配置为根据由过电流产生的热量熔化，以便中断一个部件安装的线和公共线之间的耦合。

公开(公告)号：US4743923A

公开(公告)日：1988-05-10

申请号：US941644

申请日：1986-12-15

申请人： Yasuo Nishiguchi ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi ,  Akira Sasaki ,  Yoshihito Takahashi ,  Katsumasa Mikami ,  Masafumi Suzaki ,  Akiyoshi Hakoyama

发明人： Yasuo Nishiguchi ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi ,  Akira Sasaki ,  Yoshihito Takahashi ,  Katsumasa Mikami ,  Masafumi Suzaki ,  Akiyoshi Hakoyama

IPC分类号： H01L49/02 ,  G01D15/10

CPC分类号： H01L49/02

摘要： A thin film type thermal head includes a head substrate member, a partial projected glaze portion mounted on the head substrate member, a plurality of heating resistor elements provided on the partial projected glaze portion with each of the heating resistor elements having a uniform thin thickness and two electrode end portions. A common electrode is provided on the partial projected glaze portion and an individual control electrode is also provided on the partial projected glaze portion. The partial projected glaze portion has at least two projected portions of different height with the plurality of heating resistor elements having a portion thereof disposed on at least the highest projected portion of the partial projected glaze portion with both electrode end portions of each of the heating resistor elements being disposed on the partial projected glaze portion other than the highest projected portion of the partial projected glaze portion so as to enable a recording dot to become narrow in the printing direction.

摘要翻译： 薄膜型热敏头包括头基板部件，安装在头基板部件上的部分投影釉部分，设置在部分投影釉部分上的多个加热电阻元件，每个加热电阻元件具有均匀的薄厚度， 两个电极端部。 公共电极设置在部分投射的釉面部分上，并且单独的控制电极也设置在部分投影的釉料部分上。 部分投影釉料部分具有至少两个不同高度的突出部分，多个加热电阻元件的一部分设置在部分投射釉料部分的至少最高突出部分上，其中每个发热电阻器的两个电极端部分 元件被布置在除了部分投影釉部分的最高突出部分之外的部分投影釉面部分上，以使记录点在打印方向上变窄。

公开(公告)号：US4698643A

公开(公告)日：1987-10-06

申请号：US812971

申请日：1985-12-24

申请人： Yasuo Nishiguchi ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi

发明人： Yasuo Nishiguchi ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi

IPC分类号： B41J2/345 ,  G01D15/10

CPC分类号： B41J2/345

摘要： Disclosed is a thermal head in which a plurality of heat-generating elements are arranged on a substrate on a line oblique to the scanning direction of the thermal head so that the projecting scanning region of each heat-generating element overlaps the projection scanning region of the adjacent heat-generating element over a minute space without any blank clearance between the projecting scanning regions. In this thermal head, mutual thermal influences in the heat-generating elements can be completely eliminated, and the printing quality can be improved.

摘要翻译： 公开了一种热敏头，其中多个发热元件沿着与热敏头的扫描方向相反的一条线布置在基板上，使得每个发热元件的投影扫描区域与该热敏头的投影扫描区域重叠 相邻的发热元件在几分之一的空间内，在投影的扫描区域之间没有任何空隙。 在该热敏头中，能够完全消除发热元件的热​​影响，能够提高打印质量。

公开(公告)号：US4691210A

公开(公告)日：1987-09-01

申请号：US812970

申请日：1985-12-24

申请人： Yasuo Nishiguchi ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi

发明人： Yasuo Nishiguchi ,  Tsuyoshi Yasutomi ,  Ryoichi Shiraishi

IPC分类号： B41J2/335 ,  G01D15/10

CPC分类号： B41J2/33525 ,  B41J2/33545 ,  B41J2/3357 ,  B41J2/3359

摘要： In a thermal head comprising a plurality of heat-generating elements formed on a glaze layer on a substrate, grooves extending to the midway of the glaze layer in the thickness direction of the glaze layer and having a depth of 0.3 to 30 .mu.m are formed in the surface portion of the glaze layer between every two adjacent heat-generating elements. This thermal head is improved in both the rising and falling response characteristics of the heat-generating temperature by the presence of these grooves, and sharp images having a high resolving power can be obtained.

摘要翻译： 在包括形成在基板上的釉层上的多个发热元件的热​​敏头中，形成在釉层的厚度方向上延伸至釉层中间的深度为0.3〜30μm的槽 在每两个相邻的发热元件之间的釉层的表面部分中。 通过这些凹槽的存在，该热敏头在发热温度的上升和下降响应特性方面得到改善，并且可以获得具有高分辨能力的清晰图像。

公开(公告)号：US08773833B2

公开(公告)日：2014-07-08

申请号：US13362497

申请日：2012-01-31

申请人： Toru Itabashi ,  Yuuki Mikami ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

发明人： Toru Itabashi ,  Yuuki Mikami ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC分类号： H02H5/04

CPC分类号： H01H37/32 ,  H01H37/64 ,  H01H69/022 ,  H01H85/046 ,  H05K1/0293 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09727 ,  H05K2201/10181

摘要： An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

摘要翻译： 电子控制装置包括基板，设置在基板上的多个部件安装的线，安装在各个部件安装的导线上的多个电子部件，设置在基板上并与每个电子部件耦合的公共线， 连接在组件安装线中的一个和公共线之间的中断线，连接线，中断线通过该连接线与公共线中的一个和部件安装的线中的一个耦合，以及布置在每个之间的焊料 电子部件和相应的部件安装线中的一个并且具有比中断线更低的熔点。 中断线被配置为根据由过电流产生的热量熔化，以便中断一个部件安装的线和公共线之间的耦合。