发明申请
- 专利标题: Packaging Structure and Method
- 专利标题(中): 包装结构与方法
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申请号: US13245181申请日: 2011-09-26
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公开(公告)号: US20120217635A9公开(公告)日: 2012-08-30
- 发明人: Nazir Ahmad , Young-Do Kwon , Samuel Tam , Kyung-Moon Kim , Rajendra D. Pendse
- 申请人: Nazir Ahmad , Young-Do Kwon , Samuel Tam , Kyung-Moon Kim , Rajendra D. Pendse
- 申请人地址: SG Singapore
- 专利权人: STATS CHIPPAC, LTD.
- 当前专利权人: STATS CHIPPAC, LTD.
- 当前专利权人地址: SG Singapore
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/60
摘要:
A method of making a semiconductor device includes providing a substrate and forming a conductive layer on the substrate. The conductive layer includes a first metal. A semiconductor die is provided. A bump is formed on the semiconductor die. The bump includes a second metal. The semiconductor die is positioned proximate to the substrate to contact the bump to the conductive layer and form a bonding interface. The bump and the conductive layer are metallurgically reacted at a melting point of the first metal to dissolve a portion of the second metal from an end of the bump. The bonding interface is heated to the melting point of the first metal for a time sufficient to melt a portion of the first metal from the conductive layer. A width of the conductive layer is no greater than a width of the bump.
公开/授权文献
- US20120013005A1 Packaging Structure and Method 公开/授权日:2012-01-19