利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

24 条记录 (耗时 0.017 秒)

    Energy storage device and methods of manufacture
    4.
    发明授权
    Energy storage device and methods of manufacture 失效
    储能装置及制造方法

    公开(公告)号：US5800857A

    公开(公告)日：1998-09-01

    申请号：US718569

    申请日：1996-09-30

    申请人： Nazir Ahmad ,  Keh-Chi Tsai

    发明人： Nazir Ahmad ,  Keh-Chi Tsai

    IPC分类号： H01G9/00 ,  H01G9/155 ,  H01M2/02 ,  H01M2/08 ,  H01M2/16 ,  H01M2/36 ,  H01M4/00 ,  H01M4/04 ,  H01M4/58 ,  H01M6/48 ,  H01M10/04 ,  B05D5/12

    CPC分类号： H01G9/155 ,  H01M10/0418 ,  H01M2/0212 ,  H01M2/08 ,  H01M2/1673 ,  H01M4/00 ,  H01M4/04 ,  H01M4/58 ,  H01M6/48 ,  H01M2/36 ,  H01M4/0438 ,  Y02E60/13 ,  Y10T29/41 ,  Y10T29/417

    摘要： A dry preunit (10), includes a plurality of cells (110, 112, 114) in a true bipolar configuration, which are stacked and bonded together, to impart to the device an integral and unitary construction. Each cell (114) includes two electrically conductive electrodes (111A, 111B) that are spaced apart by a predetermined distance. The cell (114) also includes two identical dielectric gaskets (121, 123) that are interposed, in registration with each other, between the electrodes (111A, 111B), for separating and electrically insulating these electrodes. When the electrodes (111A, 111B), and the gaskets (121, 123) are bonded together, at least one fill gap (130) is formed for each cell. Each cell (114) also includes a porous and conductive coating layer (119, 120) that is formed on one surface of each electrode. The coating layer (119) includes a set of closely spaced-apart peripheral microprotrusions (125), and a set of distally spaced-apart central microprotrusions (127). These microprotrusions (125, 127) impart structural support to the cells, and provide additional insulation between the electrodes. An energy storage device (10A) such as a capacitor, is created with the addition of an electrolyte to the gap (130) of the dry preunit (10) and subsequent sealing of the fill ports. Organic polymers in organic solvents are used to seal the edges of electrodes of porous metal oxides, metal nitrides, or metal carbides to reduce or eliminate leakage current. The preparation of metal nitrides and metal carbides are claimed for electrode use.

    摘要翻译： PCT No.PCT / US95 / 03985第 371日期1996年9月30日 102（e）1996年9月30日PCT 1995年3月30日PCT PCT。 公开号WO95 / 26833 日期1995年10月12日干燥单元（10）包括多个单元（110,112,114），其具有真正的双极结构，它们堆叠并结合在一起，以赋予器件整体和整体结构。 每个单元（114）包括间隔开预定距离的两个导电电极（111A，111B）。 电池（114）还包括在电极（111A，111B）之间插入彼此对准的两个相同的电介质垫圈（121,123），用于分离和电绝缘这些电极。 当电极（111A，111B）和垫圈（121,123）结合在一起时，为每个电池形成至少一个填充间隙（130）。 每个电池（114）还包括形成在每个电极的一个表面上的多孔和导电涂层（119,120）。 涂层（119）包括一组紧密间隔开的周边微突起（125）和一组远离间隔开的中心微突起（127）。 这些微突起（125,127）赋予细胞结构支撑，并在电极之间提供额外的绝缘。 通过向干燥预浸料（10）的间隙（130）添加电解液并随后密封填充口而产生诸如电容器的能量存储装置（10A）。 有机溶剂中的有机聚合物用于密封多孔金属氧化物，金属氮化物或金属碳化物电极的边缘，以减少或消除漏电流。 要求用于电极使用的金属氮化物和金属碳化物的制备。

    Electrical connectors of building integrable photovoltaic modules
    5.
    发明授权
    Electrical connectors of building integrable photovoltaic modules 有权
    建筑集成光伏组件的电连接器

    公开(公告)号：US09112080B1

    公开(公告)日：2015-08-18

    申请号：US13046461

    申请日：2011-03-11

    申请人： Jason S. Corneille ,  Michael Meyers ,  Adam C. Sherman ,  Nazir Ahmad

    发明人： Jason S. Corneille ,  Michael Meyers ,  Adam C. Sherman ,  Nazir Ahmad

    IPC分类号： H01L31/0465 ,  H01L31/05

    CPC分类号： H01L31/0504 ,  H01L31/02013 ,  H01L31/0465 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/052 ,  H01L31/18 ,  H01L31/186 ,  H02S20/23 ,  H02S20/25 ,  H02S40/36 ,  H02S40/42 ,  Y02B10/12 ,  Y02E10/50

    摘要： Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.

    摘要翻译： 提供了新型建筑可积分光伏（BIP）模块及其制造方法。 可以通过将一个或多个连接器与插入件电互连并机械地集成，从具有一个或多个光伏电池的插件制造模块。 每个连接器可以具有一个或多个导电元件，例如金属插座和/或引脚。 使用例如汇流条，所有导电元件中的至少两个电连接到光伏电池。 这些和其它电气部件使用具有至少约115℃的相对温度指数（RTI）的耐温材料进行电绝缘。绝缘可以在模块制造之前或期间提供，例如通过提供预制绝缘壳体和 /或注射成型耐温材料。 耐温材料和/或其他材料可以用于一个或多个连接器与插入件的机械一体化。

    MEMS device support structure for sensor packaging
    6.
    发明申请
    MEMS device support structure for sensor packaging 审中-公开
    用于传感器封装的MEMS器件支撑结构

    公开(公告)号：US20080277747A1

    公开(公告)日：2008-11-13

    申请号：US12151771

    申请日：2008-05-08

    申请人： Nazir Ahmad

    发明人： Nazir Ahmad

    IPC分类号： H01L29/84 ,  H01L21/00

    CPC分类号： G01L19/04 ,  G01C19/5663 ,  G01K1/12 ,  G01P1/023

    摘要： A sensor device and a method of forming comprises a die pad receives a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The sensor device includes a support structure with a CTE not compliant with the first and second CTE. The support structure has a cylindrical port that protrudes from a base and is coupled to the die pad. The cylindrical port has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the support structure undergoes thermal expansion or contraction. The base and cylindrical port can have different or similar outer diameters. The die pad has an aperture which communicates with an aperture of the MEMS device, whereby the die pad aperture has a smaller diameter than the MEMS aperture.

    摘要翻译： 一种传感器装置和一种形成方法包括：芯片接收MEMS器件。 MEMS器件具有第一热膨胀系数（CTE）。 芯片焊盘由具有与第一CTE兼容的第二CTE的材料制成。 传感器装置包括具有不符合第一和第二CTE的CTE的支撑结构。 支撑结构具有从基部突出并连接到管芯焊盘的圆柱形端口。 圆柱形端口具有高度和壁厚度，其最小化当支撑结构经受热膨胀或收缩时芯片垫和MEMS装置感觉到的力。 基座和圆柱形端口可具有不同或类似的外径。 管芯焊盘具有与MEMS器件的孔连通的孔，由此管芯焊盘孔的直径小于MEMS孔径。