发明申请
- 专利标题: Ni PLATING OF A BLM EDGE FOR Pb-FREE C4 UNDERCUT CONTROL
- 专利标题(中): Ni镀无铅C4底层控制的BLM边
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申请号: US13463879申请日: 2012-05-04
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公开(公告)号: US20120217636A1公开(公告)日: 2012-08-30
- 发明人: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- 申请人: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L23/485
- IPC分类号: H01L23/485 ; H01L21/60
摘要:
A structure and a method of manufacturing a Pb-free Controlled Collapse Chip Connection (C4) with a Ball Limiting Metallurgy (BLM) structure for semiconductor chip packaging that reduce chip-level cracking during the Back End of Line (BEOL) processes of chip-join cool-down. An edge of the BLM structure that is subject to tensile stress during chip-join cool down is protected from undercut of a metal seed layer, caused by wet etch of the chip to remove metal layers from the chip's surface and solder reflow, by an electroplated barrier layer, which covers a corresponding edge of the metal seed layer.
公开/授权文献
- US08476762B2 Ni plating of a BLM edge for Pb-free C4 undercut control 公开/授权日:2013-07-02