Invention Application
US20120220072A1 COPPER NANO PASTE, METHOD FOR FORMING THE COPPER NANO PASTE, AND METHOD FOR FORMING ELECTRODE USING THE COPPER NANO PASTE
审中-公开
铜，纳米浆，形成铜纳米粉末的方法，以及使用铜纳米粉末形成电极的方法
- Patent Title: COPPER NANO PASTE, METHOD FOR FORMING THE COPPER NANO PASTE, AND METHOD FOR FORMING ELECTRODE USING THE COPPER NANO PASTE
- Patent Title (中): 铜，纳米浆，形成铜纳米粉末的方法，以及使用铜纳米粉末形成电极的方法
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Application No.: US13311276Application Date: 2011-12-05
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Publication No.: US20120220072A1Publication Date: 2012-08-30
- Inventor: Dong Hoon KIM , Sung Il Oh , Sung Koo Kang , Byung Ho Jun , Young Ah Song , Seong Jin Kim , Byoung Jin Chun
- Applicant: Dong Hoon KIM , Sung Il Oh , Sung Koo Kang , Byung Ho Jun , Young Ah Song , Seong Jin Kim , Byoung Jin Chun
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2011-0101720 20110225
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L21/283 ; H05K3/12 ; B05D3/02 ; H01B1/22 ; B05D5/12
Abstract:
Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.
Information query
IPC分类:
