发明申请
- 专利标题： POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER
- 专利标题（中）： 用于连接芯片和载体的聚合物和焊接支架
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申请号： US13463855申请日： 2012-05-04
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公开(公告)号： US20120220117A1公开(公告)日： 2012-08-30
- 发明人: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sulliwan
- 申请人： Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sulliwan
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/283
- IPC分类号： H01L21/283
摘要：
A method of connecting chips to chip carriers, ceramic packages, etc. (package substrates) forms smaller than usual first solder balls and polymer pillars on the surface of a semiconductor chip and applies adhesive to the distal ends of the polymer pillars. The method also forms second solder balls, which are similar in size to the first solder balls, on the corresponding surface of the package substrate to which the chip will be attached. Then, the method positions the surface of the semiconductor chip next to the corresponding surface of the package substrate. The adhesive bonds the distal ends of the polymer pillars to the corresponding surface of the package substrate. The method heats the first solder balls and the second solder balls to join the first solder balls and the second solder balls into solder pillars.
公开/授权文献
- US08426247B2 Polymer and solder pillars for connecting chip and carrier 公开/授权日：2013-04-23
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