发明申请
- 专利标题： POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
- 专利标题（中）： 功率表面安装发光包装
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申请号： US13481334申请日： 2012-05-25
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公开(公告)号： US20120235199A1公开(公告)日： 2012-09-20
- 发明人: Peter Scott Andrews , Ban P. Loh
- 申请人： Peter Scott Andrews , Ban P. Loh
- 主分类号： H01L33/60
- IPC分类号： H01L33/60
摘要：
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
公开/授权文献
- US08710514B2 Power surface mount light emitting die package 公开/授权日：2014-04-29