公开(公告)号：US08835952B2

公开(公告)日：2014-09-16

申请号：US13149197

申请日：2011-05-31

申请人： Peter S. Andrews ,  Ban P. Loh ,  Nicholas W. Medendorp, Jr. ,  Bernd P. Keller

发明人： Peter S. Andrews ,  Ban P. Loh ,  Nicholas W. Medendorp, Jr. ,  Bernd P. Keller

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.

摘要翻译： 用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域 并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。 第一和第二弯液面控制特征可以与管芯附接垫基本共面。 封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂 。 还公开了方法实施例。

公开(公告)号：US08530915B2

公开(公告)日：2013-09-10

申请号：US13022365

申请日：2011-02-07

申请人： Peter Scott Andrews ,  Ban P. Loh

发明人： Peter Scott Andrews ,  Ban P. Loh

IPC分类号： B32B5/12

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

摘要翻译： 提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。 第一导电引线通过绝缘膜与基板绝缘。 第一导电引线形成用于安装发光器件的安装焊盘。 该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。

公开(公告)号：US08193547B2

公开(公告)日：2012-06-05

申请号：US13153930

申请日：2011-06-06

申请人： Ban P. Loh ,  Bernd Keller ,  Nicholas W. Medendorp, Jr.

发明人： Ban P. Loh ,  Bernd Keller ,  Nicholas W. Medendorp, Jr.

IPC分类号： H01L23/495 ,  H01L33/62

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.

摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。

公开(公告)号：US20120012879A1

公开(公告)日：2012-01-19

申请号：US13242103

申请日：2011-09-23

申请人： Ban P. Loh ,  Nicholas W. Medendorp, JR. ,  Eric Tarsa ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas W. Medendorp, JR. ,  Eric Tarsa ,  Bernd Keller

IPC分类号： H01L33/60 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L33/483 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.

摘要翻译： 用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

公开(公告)号：US20120007126A1

公开(公告)日：2012-01-12

申请号：US13237789

申请日：2011-09-20

申请人： BERND KELLER ,  Ban P. Loh

发明人： BERND KELLER ,  Ban P. Loh

IPC分类号： H01L33/50

CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

摘要翻译： 在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。 多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。 开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。 荧光体颗粒也基本上是球形或圆形。 喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。 该方法和系统特别适用于用一层磷光体材料覆盖LED。

公开(公告)号：US08044418B2

公开(公告)日：2011-10-25

申请号：US11657347

申请日：2007-01-24

申请人： Ban P. Loh ,  Nicholas W. Medendorp, Jr. ,  Eric Tarsa ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas W. Medendorp, Jr. ,  Eric Tarsa ,  Bernd Keller

IPC分类号： H01L23/495

CPC分类号： H01L33/483 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.

摘要翻译： 用于发光器件的模块化封装包括引线框架，该引线框架包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

公开(公告)号：US08039848B2

公开(公告)日：2011-10-18

申请号：US12835013

申请日：2010-07-13

申请人： Ban P. Loh ,  Nicholas W. Medendorp, Jr.

发明人： Ban P. Loh ,  Nicholas W. Medendorp, Jr.

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/34 ,  B29C2045/14844 ,  B29K2083/00 ,  B29K2995/0018 ,  B29L2011/0016 ,  H01L24/97 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

摘要翻译： 半导体发光器件封装方法包括制造在其上安装半导体发光器件的衬底。 衬底可以包括被配置为将半导体发光器件安装在其中的空腔。 半导体发光器件安装在基板上并电连接到基板的接触部分。 衬底被液体注射成型以形成在半导体发光器件上结合到衬底的光学元件。 之前可以在空腔中的电连接的半导体发光器件上施加软树脂。 还提供了半导体发光器件衬底条。

公开(公告)号：US20110248619A1

公开(公告)日：2011-10-13

申请号：US13163437

申请日：2011-06-17

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： H01J7/24

CPC分类号： F21K9/233 ,  F21K9/232 ,  F21K9/60 ,  F21V3/00 ,  F21V29/00 ,  F21Y2101/00 ,  F21Y2115/10

摘要： A lighting device such as a light bulb is disclosed. The lighting device includes an optical sub-assembly adapted to generate light when electrically excited; a body sub-assembly thermally coupled to the optical sub-assembly to draw heat away from the optical sub-assembly and to dissipate it; an electrical sub-assembly electrically connecting the optical sub-assembly to the body sub-assembly; and a final assembly covering at least a portion of the optical sub-assembly.

摘要翻译： 公开了诸如灯泡的照明装置。 照明装置包括适于在电激励时产生光的光学子组件; 热耦合到光学子组件的主体子组件以将热量从光学子组件吸走并使其散开; 将所述光学子组件电连接到所述主体子组件的电子组件; 以及覆盖光学子组件的至少一部分的最终组件。

公开(公告)号：USD641719S1

公开(公告)日：2011-07-19

申请号：US29338186

申请日：2009-06-05

申请人： Christopher P. Hussell ,  Ban P. Loh ,  Shuying Huang

设计人： Christopher P. Hussell ,  Ban P. Loh ,  Shuying Huang

CPC分类号： H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00

公开(公告)号：US07976186B2

公开(公告)日：2011-07-12

申请号：US12856320

申请日：2010-08-13

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： F21V5/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。