发明申请
US20120241920A1 EDGE BEAD REMOVAL FOR POLYBENZOXAZOLE (PBO) 审中-公开
用于聚苯并唑(PBO)的边缘珠去除

EDGE BEAD REMOVAL FOR POLYBENZOXAZOLE (PBO)
摘要:
A method of cleaning polybenzoxazole (PBO) from a semiconductor wafer coated with PBO includes baking a PBO-coated semiconductor wafer, and then exposing the semiconductor wafer with ultraviolet light through a patterned mask to soften selected regions of PBO on the semiconductor wafer. PBO is then dissolved in an edge region of the semiconductor wafer with solvent. After dissolving PBO in the edge region, the semiconductor wafer is chemically developed to dissolve the elected softened regions of PBO on the semiconductor wafer and to dissolve PBO remaining in the edge region of the semiconductor wafer that was left behind after the step of dissolving the PBO in the edge region with the solvent.
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