发明申请
- 专利标题： VIA NETWORK STRUCTURES AND METHOD THEREFOR
- 专利标题（中）： 通过网络结构及其方法
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申请号： US13079579申请日： 2011-04-04
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公开(公告)号： US20120248623A1公开(公告)日： 2012-10-04
- 发明人: Yuan Li , Som Nath Nath , Maarten van Dort
- 申请人： Yuan Li , Som Nath Nath , Maarten van Dort
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/28
摘要：
A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
公开/授权文献
- US08896124B2 Via network structures and method therefor 公开/授权日：2014-11-25
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