发明申请
US20120248634A1 METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
制造薄膜粘合剂的方法，粘合片，半导体器件以及制造半导体器件的方法
- 专利标题： METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 制造薄膜粘合剂的方法，粘合片，半导体器件以及制造半导体器件的方法
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申请号： US13509370申请日： 2010-11-10
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公开(公告)号： US20120248634A1公开(公告)日： 2012-10-04
- 发明人: Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
- 申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
- 优先权： JP2009-260410 20091113; JP2009-260421 20091113; JP2010-138638 20100617
- 国际申请： PCT/JP2010/070019 WO 20101110
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; B05D3/06 ; C09J7/02 ; H01L23/00
摘要：
The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive.
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