公开(公告)号：US20120202015A1

公开(公告)日：2012-08-09

申请号：US13365311

申请日：2012-02-03

Applicant: Aya IKEDA ,  Shinjiro Fujii ,  Takashi Kawamori ,  Takashi Masuko

Inventor： Aya IKEDA ,  Shinjiro Fujii ,  Takashi Kawamori ,  Takashi Masuko

IPC: B32B3/00 ,  B44C1/22

CPC classification number: C09J5/00 ,  C09J7/35 ,  C09J2201/28 ,  C09J2201/61 ,  C09J2479/086 ,  H01L21/6835 ,  H01L2924/10253 ,  Y10T428/24802

Abstract: The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.

Abstract translation: 根据本发明的粘合体的制造方法是通过粘合剂图案将第一被粘物和第二被粘物彼此接合的粘合体的制造方法，包括以下步骤：提供含有热固性 第一被粘物上的成分; 在与第一被粘物接触的表面相对的粘合剂层的表面上设置在用于保护粘合剂层的预定部分的保护层不被蚀刻的状态下通过蚀刻粘合剂层来形成粘合剂图案的步骤 ; 以及在除去保护层之后将第二被粘物粘接到粘合剂图案的步骤。

公开(公告)号：US20120263946A1

公开(公告)日：2012-10-18

申请号：US13509362

申请日：2010-11-10

Applicant: Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

Inventor： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

IPC: B32B7/12 ,  C09J7/02 ,  H01L21/50

CPC classification number: H01L24/27 ,  C08F220/30 ,  H01L21/565 ,  H01L21/67132 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/27002 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2224/93 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/2809 ,  Y10T428/31935 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.

Abstract translation: 本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

公开(公告)号：US20120248634A1

公开(公告)日：2012-10-04

申请号：US13509370

申请日：2010-11-10

Applicant: Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

Inventor： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

IPC: H01L21/50 ,  B05D3/06 ,  C09J7/02 ,  H01L23/00

CPC classification number: H01L24/27 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/2809 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive.

Abstract translation: 根据本发明的膜状粘合剂的制造方法包括：涂布粘合剂组合物，其包含（A）辐射聚合性化合物，（B）光引发剂和（C）热固性树脂，溶剂含量为5 质量％以下，在25℃下为液体，在基材上形成粘合剂组合物层; 并用光照射粘合剂组合物层，从而形成膜状粘合剂。