发明申请
- 专利标题： COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND METHOD FOR FORMING PATTERN
- 专利标题（中）： 用于形成电阻膜的组合物和形成图案的方法
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申请号： US13221853申请日： 2011-08-30
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公开(公告)号： US20120252217A1公开(公告)日： 2012-10-04
- 发明人: Shin-ya MINEGISHI , Yushi MATSUMURA , Shinya NAKAFUJI , Kazuhiko KOMURA , Takanori NAKANO , Satoru MURAKAMI , Kyoyu YASUDA , Makoto SUGIURA
- 申请人： Shin-ya MINEGISHI , Yushi MATSUMURA , Shinya NAKAFUJI , Kazuhiko KOMURA , Takanori NAKANO , Satoru MURAKAMI , Kyoyu YASUDA , Makoto SUGIURA
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-081332 20110331
- 主分类号： H01L21/311
- IPC分类号： H01L21/311 ; C08G65/48 ; C08F236/20 ; C08G8/02 ; C08G8/04 ; C08G8/30 ; C08F238/00
摘要：
A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1≡R2 (2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.
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