发明申请
- 专利标题： ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF
- 专利标题（中）： 胶粘组合物，其半导体器件及其制造方法
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申请号： US13509355申请日： 2010-11-10
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公开(公告)号： US20120256326A1公开(公告)日： 2012-10-11
- 发明人: Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
- 申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
- 优先权： JP2009-260410 20091113
- 国际申请： PCT/JP2010/070016 WO 20101110
- 主分类号： C09J163/00
- IPC分类号： C09J163/00 ; H01L29/02 ; C09J163/02 ; H01L21/50
摘要：
Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm2 or less at 30° C. and 200 gf/cm2 or more at 120° C.
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