Invention Application
- Patent Title: Method for Metal Deposition Using Hydrogen Plasma
- Patent Title (中): 使用氢等离子体金属沉积的方法
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Application No.: US13082968Application Date: 2011-04-08
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Publication No.: US20120258602A1Publication Date: 2012-10-11
- Inventor: Anantha K. Subramani , John C. Forster , Seshadri Ganguli , Michael S. Jackson , Xinliang Lu , Wei W. Wang , Xinyu Fu , Yu Lei
- Applicant: Anantha K. Subramani , John C. Forster , Seshadri Ganguli , Michael S. Jackson , Xinliang Lu , Wei W. Wang , Xinyu Fu , Yu Lei
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
Methods for formation and treatment of pure metal layers using CVD and ALD techniques are provided. In one or more embodiments, the method includes forming a metal precursor layer and treating the metal precursor layer to a hydrogen plasma to reduce the metal precursor layer to form a metal layer. In one or more embodiments, treating the metal precursor layer includes exposing the metal precursor layer to a high frequency-generated hydrogen plasma. Methods of preventing a hydrogen plasma from penetrating a metal precursor layer are also provided.
Public/Granted literature
- US08637410B2 Method for metal deposition using hydrogen plasma Public/Granted day:2014-01-28
Information query
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