发明申请
US20120263946A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER
审中-公开
半导体器件，制造半导体器件的方法和具有粘合层的半导体器件
- 专利标题： SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER
- 专利标题（中）： 半导体器件，制造半导体器件的方法和具有粘合层的半导体器件
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申请号： US13509362申请日： 2010-11-10
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公开(公告)号： US20120263946A1公开(公告)日： 2012-10-18
- 发明人: Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
- 申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
- 优先权： JP2009-260421 20091113; JP2010-198108 20100903
- 国际申请： PCT/JP2010/070014 WO 20101110
- 主分类号： B32B7/12
- IPC分类号： B32B7/12 ; C09J7/02 ; H01L21/50
摘要：
Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.
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