发明申请
- 专利标题: COMPONENT MOUNTING APPARATUS, MOUNTING-COMPONENT PRODUCING METHOD, AND CONVEYOR APPARATUS
- 专利标题(中): 组件安装设备,安装组件生产方法和输送机设备
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申请号: US13453558申请日: 2012-04-23
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公开(公告)号: US20120267216A1公开(公告)日: 2012-10-25
- 发明人: Akira Kimura , Katsuhiko Ohno , Atsushi Saito
- 申请人: Akira Kimura , Katsuhiko Ohno , Atsushi Saito
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-100113 20080408
- 主分类号: B65G37/00
- IPC分类号: B65G37/00
摘要:
A component mounting apparatus includes: a load area to load a substrate; an unload area to unload the substrate; a main area interposed between the load and unload areas, including a first area including a first mounting area, a second area including a second mounting area, and a third area interposed therebetween; two mounting units to mount, on the substrate, first and second components in the first and second mounting areas, respectively; a conveyor group to convey the substrate, including first to fourth conveyors, the second and fourth conveyors being capable of receiving the substrate from the first and third conveyors in the first and second areas, respectively; and a driving mechanism capable of moving at least one of the first and second conveyors between the first and third areas and moving at least one of the third and fourth conveyors between the second and third areas.
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