发明申请
- 专利标题： POLISHING PAD WEAR DETECTING APPARATUS
- 专利标题（中）： 抛光垫磨损检测装置
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申请号： US13090284申请日： 2011-04-20
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公开(公告)号： US20120270474A1公开(公告)日： 2012-10-25
- 发明人: Chien-Mao Liao , Yi-Nan Chen , Hsien-Wen Liu
- 申请人： Chien-Mao Liao , Yi-Nan Chen , Hsien-Wen Liu
- 申请人地址： TW Taoyuan
- 专利权人： NANYA TECHNOLOGY CORPORATION
- 当前专利权人： NANYA TECHNOLOGY CORPORATION
- 当前专利权人地址： TW Taoyuan
- 主分类号： B24B49/00
- IPC分类号： B24B49/00
摘要：
A polishing pad wear detecting apparatus suitable for a chemical mechanical polishing (CMP) apparatus is provided. The polishing pad wear detecting apparatus includes an arm and a height detector. One end of the arm is fastened on the CMP apparatus. The height detector is disposed on the arm for detecting height variation of a polishing pad.
信息查询
