公开(公告)号：US20120264359A1

公开(公告)日：2012-10-18

申请号：US13085489

申请日：2011-04-13

申请人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： B24B7/22

CPC分类号： B24B37/30

摘要： A membrane is suitable to be mounted on a polishing head of a chemical mechanical polishing apparatus and includes a main portion and an edge portion. The edge portion is located at an edge of the main portion, wherein a first included angle between the main portion and the edge portion is an obtuse angle.

摘要翻译： 膜适于安装在化学机械抛光装置的抛光头上，并且包括主要部分和边缘部分。 边缘部分位于主要部分的边缘处，其中主要部分和边缘部分之间的第一夹角是钝角。

公开(公告)号：US20120270474A1

公开(公告)日：2012-10-25

申请号：US13090284

申请日：2011-04-20

申请人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： B24B49/00

CPC分类号： B24B37/34 ,  B24B49/00

摘要： A polishing pad wear detecting apparatus suitable for a chemical mechanical polishing (CMP) apparatus is provided. The polishing pad wear detecting apparatus includes an arm and a height detector. One end of the arm is fastened on the CMP apparatus. The height detector is disposed on the arm for detecting height variation of a polishing pad.

摘要翻译： 提供了适用于化学机械抛光（CMP）装置的抛光垫磨损检测装置。 抛光垫磨损检测装置包括臂和高度检测器。 臂的一端固定在CMP装置上。 高度检测器设置在臂上用于检测抛光垫的高度变化。

公开(公告)号：US08545289B2

公开(公告)日：2013-10-01

申请号：US13086367

申请日：2011-04-13

申请人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： B24B49/00

CPC分类号： H01L21/67259 ,  B24B37/005 ,  B24B37/30 ,  B24B49/08 ,  B24B49/10 ,  B24B49/12 ,  H01L21/68735

摘要： A distance monitoring device is provided. The device is suitable for a chemical mechanical polishing (CMP) apparatus. A polishing head of the CMP apparatus includes a frame and a membrane. The membrane is mounted on the frame, and a plurality of air bags is formed by the membrane and the frame in the polishing head. The distance monitoring device includes a plurality of distance detectors disposed on the frame corresponding to the air bags respectively to set a location of each of the distance detectors on the frame as a reference point, wherein each of the distance detectors is configured to measure a distance between each of the reference points and the membrane.

摘要翻译： 提供了一种距离监测装置。 该设备适用于化学机械抛光（CMP）设备。 CMP设备的抛光头包括框架和膜。 膜安装在框架上，并且多个气囊由抛光头中的膜和框架形成。 距离监视装置包括多个距离检测器，其分别布置在与气囊对应的框架上，以将每个距离检测器的位置设置在框架上作为参考点，其中每个距离检测器被配置成测量距离 在每个参考点和膜之间。

公开(公告)号：US20120264354A1

公开(公告)日：2012-10-18

申请号：US13086367

申请日：2011-04-13

申请人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： B24B49/12 ,  B24B49/08

CPC分类号： H01L21/67259 ,  B24B37/005 ,  B24B37/30 ,  B24B49/08 ,  B24B49/10 ,  B24B49/12 ,  H01L21/68735

摘要： A distance monitoring device is provided. The device is suitable for a chemical mechanical polishing (CMP) apparatus. A polishing head of the CMP apparatus includes a frame and a membrane. The membrane is mounted on the frame, and a plurality of air bags is formed by the membrane and the frame in the polishing head. The distance monitoring device includes a plurality of distance detectors disposed on the frame corresponding to the air bags respectively to set a location of each of the distance detectors on the frame as a reference point, wherein each of the distance detectors is configured to measure a distance between each of the reference points and the membrane.

摘要翻译： 提供了一种距离监测装置。 该设备适用于化学机械抛光（CMP）设备。 CMP设备的抛光头包括框架和膜。 膜安装在框架上，并且多个气囊由抛光头中的膜和框架形成。 距离监视装置包括多个距离检测器，其分别布置在与气囊对应的框架上，以将每个距离检测器的位置设置在框架上作为参考点，其中每个距离检测器被配置成测量距离 在每个参考点和膜之间。

公开(公告)号：US20120264300A1

公开(公告)日：2012-10-18

申请号：US13086366

申请日：2011-04-13

申请人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： H01L21/306

CPC分类号： H01L21/3212 ,  H01L21/7684 ,  H01L21/76898

摘要： A method of fabricating the semiconductor component including following steps is provided. A substrate is provided, wherein an opening is already formed in the substrate. A material layer is formed on the substrate, wherein the material layer fills up the opening, and the material layer outside and above the opening has a recess therein. A sacrifice layer is formed on a surface of the recess. A chemical mechanical polishing (CMP) process is performed to remove the sacrifice layer and the material layer outside the opening, wherein a polishing rate of the CMP process on the material layer is greater than that of the CMP process on the sacrifice layer.

摘要翻译： 提供一种制造半导体元件的方法，包括以下步骤。 提供了一种基板，其中已经在基板中形成了开口。 在基板上形成材料层，其中材料层填充开口，并且开口外部和上方的材料层在其中具有凹部。 牺牲层形成在凹部的表面上。 进行化学机械抛光（CMP）工艺以去除开口外部的牺牲层和材料层，其中在牺牲层上CMP材料层上的CMP工艺的抛光速率大于抛光速率。

公开(公告)号：US20120264299A1

公开(公告)日：2012-10-18

申请号：US13085487

申请日：2011-04-13

申请人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chien-Mao Liao ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： H01L21/306

CPC分类号： H01L21/3212 ,  H01L21/31053

摘要： A chemical mechanical polishing (CMP) method is provided The method is capable of polishing a substrate in a CMP apparatus by using a hydrophobic polishing pad and includes following steps. A first CMP process is performed to the substrate. A first cleaning process is performed to the hydrophobic polishing pad. A second CMP process is performed to the substrate, wherein the first CMP process, the first cleaning process and the second CMP process are performed in sequence.

摘要翻译： 提供了化学机械抛光（CMP）方法。该方法能够通过使用疏水性抛光垫在CMP设备中抛光衬底，并且包括以下步骤。 对基板进行第一CMP处理。 对疏水性抛光垫进行第一清洗处理。 对基板执行第二CMP处理，其中依次执行第一CMP处理，第一清洗处理和第二CMP处理。

公开(公告)号：US08912595B2

公开(公告)日：2014-12-16

申请号：US13106852

申请日：2011-05-12

申请人： Chin-Te Kuo ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chin-Te Kuo ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： H01L29/78 ,  H01L29/423 ,  H01L29/66 ,  H01L21/308

CPC分类号： H01L29/7813 ,  H01L21/3083 ,  H01L29/4236 ,  H01L29/66666 ,  H01L29/66734 ,  H01L29/7827

摘要： A trench MOS structure is disclosed. The trench MOS structure includes a substrate, an epitaxial layer, a doping well, a doping region and a trench gate. The substrate has a first conductivity type, a first side and a second side opposite to the first side. The epitaxial layer has the first conductivity type and is disposed on the first side. The doping well has a second conductivity type and is disposed on the epitaxial layer. The doping region has the first conductivity type and is disposed on the doping well. The trench gate is partially disposed in the doping region. The trench gate has a bottle shaped profile with a top section smaller than a bottom section, both are partially disposed in the doping well. The bottom section of two adjacent trench gates results in a higher electrical field around the trench MOS structures.

摘要翻译： 公开了一种沟槽MOS结构。 沟槽MOS结构包括衬底，外延层，掺杂阱，掺杂区和沟槽栅。 衬底具有第一导电类型，第一侧和与第一侧相对的第二侧。 外延层具有第一导电类型并且设置在第一侧。 掺杂阱具有第二导电类型并且设置在外延层上。 掺杂区域具有第一导电类型并且被布置在掺杂阱上。 沟槽栅极部分地设置在掺杂区域中。 沟槽门具有瓶形轮廓，其顶部部分小于底部部分，都部分地设置在掺杂井中。 两个相邻沟槽栅极的底部部分导致沟槽MOS结构周围的较高电场。

公开(公告)号：US08816715B2

公开(公告)日：2014-08-26

申请号：US13105913

申请日：2011-05-12

申请人： Chin-Te Kuo ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chin-Te Kuo ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： G01R31/02 ,  G01R31/26 ,  H01L21/66 ,  G01R31/28

CPC分类号： H01L22/34 ,  G01R31/02 ,  G01R31/26 ,  G01R31/2644 ,  G01R31/2831

摘要： A MOS test structure is disclosed. A scribe line region is disposed on a substrate which has a first side and a second side opposite to the first side. An epitaxial layer is disposed on the first side, the doping well is disposed on the epitaxial layer and the doping region is disposed on the doping well. A trench gate of a first depth is disposed in the doping region, in the doping well and in the scribe line region. A conductive material fills the test via which has a second depth and an isolation covering the inner wall of the test via and is disposed in the doping region, in the doping well, in the epitaxial layer and in the scribe line region, to electrically connect to the epitaxial layer so that the test via is capable of testing the epitaxial layer and the substrate together.

摘要翻译： 公开了MOS测试结构。 划线区域设置在具有与第一侧相对的第一侧和第二侧的基板上。 外延层设置在第一侧上，掺杂阱设置在外延层上，并且掺杂区域设置在掺杂阱上。 第一深度的沟槽栅极设置在掺杂区域，掺杂阱和划线区域中。 导电材料填充测试，通过该测试具有覆盖测试通孔的内壁的第二深度和隔离，并且设置在掺杂区域，掺杂阱，外延层和划线区域中，以电连接 到外延层，使得测试通孔能够一起测试外延层和衬底。

公开(公告)号：US08692318B2

公开(公告)日：2014-04-08

申请号：US13104924

申请日：2011-05-10

申请人： Chin-Te Kuo ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Chin-Te Kuo ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： H01L29/66

CPC分类号： H01L29/7813 ,  H01L29/0619 ,  H01L29/0649 ,  H01L29/0696 ,  H01L29/1095 ,  H01L29/66734

摘要： A trench MOS structure is provided. The trench MOS structure includes a substrate, an epitaxial layer, a trench, a gate isolation, a trench gate, a guard ring and a reinforcement structure within the guard ring. The substrate has a first conductivity type, a first side and a second side opposite to the first side. The epitaxial layer has the first conductivity type and is disposed on the first side. The trench is disposed in the epitaxial layer. The gate isolation covers the inner wall of the trench. The trench gate is disposed in the trench and has the first conductivity type. The guard ring has a second conductivity type and is disposed within the epitaxial layer. The reinforcement structure has an electrically insulating material and is disposed within the guard ring.

摘要翻译： 提供沟槽MOS结构。 沟槽MOS结构包括保护环内的衬底，外延层，沟槽，栅极隔离，沟槽栅极，保护环和加强结构。 衬底具有第一导电类型，第一侧和与第一侧相对的第二侧。 外延层具有第一导电类型并且设置在第一侧。 沟槽设置在外延层中。 栅极隔离覆盖沟槽的内壁。 沟槽栅设置在沟槽中并且具有第一导电类型。 保护环具有第二导电类型并且设置在外延层内。 加强结构具有电绝缘材料并且设置在保护环内。

公开(公告)号：US08458842B2

公开(公告)日：2013-06-11

申请号：US13104964

申请日：2011-05-10

申请人： Li-Chung Liu ,  Yi-Nan Chen ,  Hsien-Wen Liu

发明人： Li-Chung Liu ,  Yi-Nan Chen ,  Hsien-Wen Liu

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  H01L21/02052 ,  H01L21/67046

摘要： A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.

摘要翻译： CMP后晶片清洗装置包括：腔室; 多个辊子，适于在所述腔室内保持和旋转晶片; 至少一个刷子，适于擦拭要清洁的晶片的表面; 以及适于将液体喷射在晶片上的液体喷射装置，所述液体喷射装置包括通过接头构件连接在一起的两个喷射杆。