Invention Application
US20120273454A1 ETCHING LIQUID FOR CONDUCTIVE POLYMER, AND METHOD FOR PATTERNING CONDUCTIVE POLYMER
审中-公开
用于导电聚合物的蚀刻液和用于形成导电聚合物的方法
- Patent Title: ETCHING LIQUID FOR CONDUCTIVE POLYMER, AND METHOD FOR PATTERNING CONDUCTIVE POLYMER
- Patent Title (中): 用于导电聚合物的蚀刻液和用于形成导电聚合物的方法
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Application No.: US13453308Application Date: 2012-04-23
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Publication No.: US20120273454A1Publication Date: 2012-11-01
- Inventor: Takashi IHARA , Takahiro Fujimoto
- Applicant: Takashi IHARA , Takahiro Fujimoto
- Applicant Address: JP Tokyo JP Yokohama-shi
- Assignee: TOAGOSEI CO., LTD.,TSURUMI SODA CO., LTD.
- Current Assignee: TOAGOSEI CO., LTD.,TSURUMI SODA CO., LTD.
- Current Assignee Address: JP Tokyo JP Yokohama-shi
- Priority: JP2006-268663 20060929; JP2006-268694 20060929; JP2006-268737 20060929; JP2006-301212 20061107
- Main IPC: C09K13/00
- IPC: C09K13/00 ; H01B13/00 ; C09K13/04
Abstract:
An etching liquid for a conductive polymer is disclosed which comprises greater than 0.5 wt % but no greater than 30 wt % of (NH4)4Ce(S04)4.
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