发明申请
US20120286385A1 SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
审中-公开
半导体器件，相机模块和半导体器件制造方法
- 专利标题： SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- 专利标题（中）： 半导体器件，相机模块和半导体器件制造方法
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申请号： US13555259申请日： 2012-07-23
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公开(公告)号： US20120286385A1公开(公告)日： 2012-11-15
- 发明人: Shigeru Yamada
- 申请人： Shigeru Yamada
- 申请人地址： JP Tokyo
- 专利权人： LAPIS SEMICONDUCTOR CO., LTD.
- 当前专利权人： LAPIS SEMICONDUCTOR CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-058283 20080307
- 主分类号： H01L31/0203
- IPC分类号： H01L31/0203 ; H01L31/0232
摘要：
A semiconductor device is provided which has a semiconductor element having an element forming surface at which a sensor element is formed, a back surface on the opposite side of the element forming surface, and a light transmissive protective member laminated over the element forming surface via an adhering portion. The semiconductor device includes a region exposed from the protective member at the outer peripheral end portion of the semiconductor element, when viewed from the protecting member in a laminating direction.