公开(公告)号：US09082564B2

公开(公告)日：2015-07-14

申请号：US13701354

申请日：2011-05-09

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01H3/12 ,  H01H13/705 ,  H01H13/7065

CPC分类号： H01H13/705 ,  H01H3/122 ,  H01H3/125 ,  H01H13/7065 ,  H01H2221/026 ,  H01H2221/058

摘要： A key switch structure which enables a reduction in the width of the key switch. A key switch structure comprises a first support member (22), a second support member (23), and a third support member which are arranged independently of each other, the first support member (22) having rotation pins (22d, 22e) and slide pins (22a, 22b), the second support member (23) having rotation pins (23e, 23f) and a circular columnar slide section (23a), the third support member having front end sections (24d, 24e), which are slidably held, and a support shaft section (24a). A key top (21) is supported by the support members (22, 23, 24) so that the key top (21) can move in the vertical direction. The length of at least one side of each of the support members is set to be less than or equal to the mounting diameter of a rubber dome (27).

摘要翻译： 一种能够减小钥匙开关宽度的钥匙开关结构。 钥匙开关结构包括彼此独立地布置的第一支撑构件（22），第二支撑构件（23）和第三支撑构件，第一支撑构件（22）具有旋转销（22d，22e）和 滑动销（22a，22b），具有旋转销（23e，23f）的第二支撑构件（23）和圆柱形滑动部分（23a），第三支撑构件具有前端部分（24d，24e） 和支撑轴部（24a）。 键顶（21）由支撑构件（22,23,24）支撑，使得键顶（21）能够在垂直方向上移动。 每个支撑构件的至少一侧的长度被设定为小于或等于橡胶圆顶（27）的安装直径。

公开(公告)号：US08735748B2

公开(公告)日：2014-05-27

申请号：US12737869

申请日：2010-06-04

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01H9/26

CPC分类号： H01H3/125 ,  H01H13/705 ,  H01H13/83 ,  H01H13/86 ,  H01H2215/004 ,  H01H2219/03 ,  H01H2219/06 ,  H01H2219/062 ,  H01H2221/002 ,  H01H2221/07 ,  H01H2223/003 ,  H01H2223/034 ,  H01H2229/026 ,  H01H2233/03 ,  H01H2239/038

摘要： There is provided a keyboard structure capable of preventing a fingernail of a user from being inserted between key tops and achieving uniform illumination without illumination leakage. A key top body portion (120a) and an upper sheet (120b) are integrally formed to form a key top (120) and a flange portion (120d) is formed by protruding the upper sheet (120b) from the key top body portion (120a) toward an outer circumferential direction. A frame (122) is disposed between the adjacent key tops (120) and a gap is closed by the flange portion (120d) of the upper sheet (120b) and a flange portion (122a) of the frame (122).

摘要翻译： 提供了一种键盘结构，其能够防止用户的指甲被插入键顶之间并且实现均匀的照明而没有照射泄漏。 一体形成键顶部主体部分（120a）和上部片材（120b）以形成键顶（120），并且通过使上部片材（120b）从键顶主体部分突出而形成凸缘部分（120d） 120a）朝向外周方向。 框架（122）设置在相邻的键顶（120）之间，并且间隙由上片（120b）的凸缘部分（120d）和框架（122）的凸缘部分（122a）封闭。

公开(公告)号：US20120286385A1

公开(公告)日：2012-11-15

申请号：US13555259

申请日：2012-07-23

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L31/0203 ,  H01L31/0232

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A semiconductor device is provided which has a semiconductor element having an element forming surface at which a sensor element is formed, a back surface on the opposite side of the element forming surface, and a light transmissive protective member laminated over the element forming surface via an adhering portion. The semiconductor device includes a region exposed from the protective member at the outer peripheral end portion of the semiconductor element, when viewed from the protecting member in a laminating direction.

摘要翻译： 提供一种半导体器件，其具有半导体元件，其具有形成有传感器元件的元件形成表面，元件形成表面的相对侧上的后表面，以及透光保护元件，其经由元件形成表面经由 粘附部分。 半导体器件包括从保护部件沿着层叠方向观察时从半导体元件的外周端部的保护部件露出的区域。

公开(公告)号：US20110287585A1

公开(公告)日：2011-11-24

申请号：US13205581

申请日：2011-08-08

申请人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

IPC分类号： H01L21/78

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

摘要翻译： 一种制造半导体器件和半导体器件的方法，包括安装在基板的第一表面上的第一半导体元件，其中焊球形成在基板的第二相对表面上，使得第二相对表面包括区域 没有焊球。 至少一个第二半导体元件在没有焊球的第二表面的区域处安装到基板。 可以使用低分子粘合剂或替代的高温焊料将至少一个半导体元件安装到基板。

公开(公告)号：US20110155551A1

公开(公告)日：2011-06-30

申请号：US12737869

申请日：2010-06-04

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01H13/76

CPC分类号： H01H3/125 ,  H01H13/705 ,  H01H13/83 ,  H01H13/86 ,  H01H2215/004 ,  H01H2219/03 ,  H01H2219/06 ,  H01H2219/062 ,  H01H2221/002 ,  H01H2221/07 ,  H01H2223/003 ,  H01H2223/034 ,  H01H2229/026 ,  H01H2233/03 ,  H01H2239/038

摘要： There is provided a keyboard structure capable of preventing a fingernail of a user from being inserted between key tops and achieving uniform illumination without illumination leakage. A key top body portion (120a) and an upper sheet (120b) are integrally formed to form a key top (120) and a flange portion (120d) is formed by protruding the upper sheet (120b) from the key top body portion (120a) toward an outer circumferential direction. A frame (122) is disposed between the adjacent key tops (120) and a gap is closed by the flange portion (120d) of the upper sheet (120b) and a flange portion (122a) of the frame (122).

摘要翻译： 提供了一种键盘结构，其能够防止用户的指甲被插入键顶之间并且实现均匀的照明而没有照射泄漏。 一体形成键顶部主体部分（120a）和上部片材（120b）以形成键顶（120），并且通过使上部片材（120b）从键顶主体部分突出而形成凸缘部分（120d） 120a）朝向外周方向。 框架（122）设置在相邻的键顶（120）之间，并且间隙由上片（120b）的凸缘部分（120d）和框架（122）的凸缘部分（122a）封闭。

公开(公告)号：US20110108401A1

公开(公告)日：2011-05-12

申请号：US12737434

申请日：2009-05-28

申请人： Shigeru Yamada ,  Yasushi Takagi

发明人： Shigeru Yamada ,  Yasushi Takagi

IPC分类号： H01H9/04 ,  H01H11/00

CPC分类号： H01H3/125 ,  H01H13/86 ,  H01H2223/003 ,  H01H2229/028 ,  Y10T29/49105

摘要： A key switch structure is provided whose waterproofing property is improved without affecting a contact of a membrane sheet. The upper surfaces of the membrane sheet, the embossed part and the circumferential bend part of a back plate are formed on one and the same plane, and a thermal sheet is welded to those upper surfaces. The thermal sheet comprises a thermally meltable, adhesive sheet, which will be heated and pressed with heat rollers to be welded to the upper surfaces. The back plate has an air vent hole formed in its bottom portion.

摘要翻译： 提供了一种键开关结构，其防水性能得到改善，而不影响膜片的接触。 膜片的上表面，压花部分和背板的周向弯曲部分形成在同一平面上，并且热敏片被焊接到那些上表面。 热敏片包括可热熔粘合片，其将被加热并被加热辊压制以焊接到上表面。 背板具有形成在其底部的通气孔。

公开(公告)号：US20100025710A1

公开(公告)日：2010-02-04

申请号：US12461051

申请日：2009-07-30

申请人： Shigeru Yamada ,  Makoto Terui ,  Yoshimi Egawa ,  Shinji Ohuchi

发明人： Shigeru Yamada ,  Makoto Terui ,  Yoshimi Egawa ,  Shinji Ohuchi

IPC分类号： H01L33/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2924/00014 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/05099

摘要： There is provided a semiconductor device including: a semiconductor chip having a penetrating electrode penetrating through from a first main surface of the semiconductor chip to a second main surface on the opposite side thereof, a photoreceptor portion formed on the first main surface, and a first wire at a periphery of the photoreceptor portion; a light transmitting chip adhered to the first main surface at the periphery of the light transmitting chip, with a bonding layer interposed between the light transmitting chip and the first main surface, the light transmitting chip covering the light transmitting chip; and a light blocking resin layer formed only on the side surfaces of the light transmitting chip and the bonding layer.

摘要翻译： 提供了一种半导体器件，包括：半导体芯片，其具有从半导体芯片的第一主表面穿透到其相反侧的第二主表面的穿透电极，形成在第一主表面上的感光体部分， 在感光体部分的周围布线; 光传输芯片，其附着在所述透光芯片周边的第一主表面，并且在所述透光芯片和所述第一主表面之间插入有接合层，所述透光芯片覆盖所述透光芯片; 以及仅形成在透光片和接合层的侧面上的遮光树脂层。

公开(公告)号：US20090238368A1

公开(公告)日：2009-09-24

申请号：US10569961

申请日：2005-01-31

申请人： Masao Nonaka ,  Yuichi Futa ,  Motoji Ohmori ,  Shigeru Yamada ,  Tetsuya Inoue ,  Yoji Kumazaki ,  Wataru Kuroiwa ,  Shinichi Oi ,  Osamu Yoshida

发明人： Masao Nonaka ,  Yuichi Futa ,  Motoji Ohmori ,  Shigeru Yamada ,  Tetsuya Inoue ,  Yoji Kumazaki ,  Wataru Kuroiwa ,  Shinichi Oi ,  Osamu Yoshida

IPC分类号： H04L9/08 ,  H04L9/06

CPC分类号： H04L9/0833 ,  H04L9/0891 ,  H04L2209/60

摘要： The cloning source of an authorized receiving device cannot be identified. A key distribution system 1 concerning the present invention includes: a communication channel 10; a key distribution center 11; a server 12; and receiving devices 13a to 13n. The key distribution center 11 distributes, to the server 12, the information necessary for distributing shared keys SK to the receiving devices 13a to 13n, and distributes the individual information group EMMG necessary for receiving the shared keys SK from the server 12. The server 12 generates the shared keys SK, generates the common information ECM based on the shared keys SK and the system secret variable group set SPGS, and distributes the common information ECM to the receiving devices 13a to 13n. The receiving devices 13a to 13n obtain the shared keys SK based on the individual information group EMMG and the common information ECM and outputs them to outside.

摘要翻译： 授权接收设备的克隆源无法识别。 关于本发明的密钥分发系统1包括：通信信道10; 密钥分配中心11; 服务器12; 以及接收装置13a〜13n。 密钥分配中心11向服务器12分配向接收设备13a至13n分配共享密钥SK所需的信息，并且从服务器12分发用于接收共享密钥SK所必需的个人信息组EMMG。服务器12 生成共享密钥SK，基于共享密钥SK和系统秘密变量组集SPGS生成公共信息ECM，并将公共信息ECM分配给接收装置13a〜13n。 接收设备13a至13n基于个人信息组EMMG和公共信息ECM获得共享密钥SK并将其输出到外部。

公开(公告)号：US07486403B2

公开(公告)日：2009-02-03

申请号：US11779754

申请日：2007-07-18

申请人： Tatsuo Osaka ,  Yoshikatsu Okada ,  Shigeru Yamada ,  Keiji Sakai

发明人： Tatsuo Osaka ,  Yoshikatsu Okada ,  Shigeru Yamada ,  Keiji Sakai

IPC分类号： G01B11/02 ,  G01N21/00

CPC分类号： G01B11/08 ,  G01N15/1463 ,  G01N2013/0208 ,  G01N2015/1497

摘要： In order to accurately measure a shape feature of a minute droplet arranged on a substrate by a simple method, with respect to the droplet, the substrate is perpendicularly irradiated with laser light to cause diffracted light fluxes generated during passage of the laser light through the droplet to interfere with each other, so that a diffraction pattern is obtained. The diffraction pattern formed on a screen of a detector as an image is picked up by an image pickup apparatus. The shape feature of the droplet is measured by using the resultant diffraction pattern and a refractive index of the droplet.

摘要翻译： 为了通过简单的方法精确地测量布置在基板上的微小液滴的形状特征，相对于液滴，用激光垂直地照射基板，使激光通过液滴时产生的衍射光束 彼此干涉，从而获得衍射图案。 在作为图像的检测器的屏幕上形成的衍射图案由图像拾取装置拾取。 通过使用所得到的衍射图案和液滴的折射率来测量液滴的形状特征。

公开(公告)号：US07332373B2

公开(公告)日：2008-02-19

申请号：US10885785

申请日：2004-07-08

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L21/78

CPC分类号： H01L24/12 ,  H01L21/56 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/94 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a method of manufacturing semiconductor device. The method includes providing a semiconductor wafer having a main surface; defining a chip forming region which includes chip regions defined by scribe lines, and a peripheral region which surrounds the chip forming region, on the main surface; forming circuit elements and electrode pads connected to the circuit elements on the chip areas; forming an insulating film, which exposes respective portions of the electrode pads, on the main surface; forming protruded electrodes on the insulating film provided in the chip areas so that the protruded electrodes are arranged at predetermined intervals in the chip area; forming an encapsulating material, which exposes top faces of the protruded electrodes, on the insulating film; and cutting the semiconductor wafer along the scribe lines.

摘要翻译： 本发明提供半导体器件的制造方法。 该方法包括提供具有主表面的半导体晶片; 限定芯片形成区域，其包括由划线限定的芯片区域和在主表面上包围芯片形成区域的周边区域; 形成电路元件和连接到芯片区域上的电路元件的电极焊盘; 形成在主表面露出电极焊盘的各部分的绝缘膜; 在设置在芯片区域中的绝缘膜上形成突出电极，使得突出电极以预定的间隔布置在芯片区域中; 形成在所述绝缘膜上露出所述突出电极的顶面的封装材料; 并沿切割线切割半导体晶片。