发明申请
US20120291275A1 METHOD OF FORMING METAL INTERCONNECTION LINE ON FLEXIBLE SUBSTRATE
审中-公开
金属互连线在柔性基板上的形成方法
- 专利标题: METHOD OF FORMING METAL INTERCONNECTION LINE ON FLEXIBLE SUBSTRATE
- 专利标题(中): 金属互连线在柔性基板上的形成方法
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申请号: US13337650申请日: 2011-12-27
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公开(公告)号: US20120291275A1公开(公告)日: 2012-11-22
- 发明人: Jong-Joo RHA , Kee-Seok NAM , Jung-Dae KWON , Kyu-Hwan LEE , Jong-Soo BAE , Joo-Yul LEE , Jong-Soo KO
- 申请人: Jong-Joo RHA , Kee-Seok NAM , Jung-Dae KWON , Kyu-Hwan LEE , Jong-Soo BAE , Joo-Yul LEE , Jong-Soo KO
- 申请人地址: KR Daejeon
- 专利权人: KOREA INSTITUTE OF MACHINERY & MATERIALS
- 当前专利权人: KOREA INSTITUTE OF MACHINERY & MATERIALS
- 当前专利权人地址: KR Daejeon
- 优先权: KR10-2011-0047107 20110519; KR10-2011-0138131 20111220
- 主分类号: H05K3/10
- IPC分类号: H05K3/10
摘要:
Provided is a method of forming a metal interconnection line on a flexible substrate, wherein the method includes: coating a hard mask layer on at least one surface of the flexible substrate, followed by performing photolithography thereon to form a predetermined hard mask pattern; etching a portion of the flexible substrate by using the hard mask pattern as a mask to form a trench; plasma treating the inside of the trench by using a treatment gas for pre-treating the flexible substrate; coating a seed layer inside the trench; removing the hard mask pattern; and filling the inside of the trench coated with the seed layer with metal. A metal interconnection line formed by using the method may have a strong adhesion force with respect to the flexible substrate.