发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13477353申请日: 2012-05-22
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公开(公告)号: US20120298999A1公开(公告)日: 2012-11-29
- 发明人: Yasuhiro JINBO , Koji DAIRIKI , Hidekazu MIYAIRI , Tomohiro KIMURA , Yoshitaka YAMAMOTO
- 申请人: Yasuhiro JINBO , Koji DAIRIKI , Hidekazu MIYAIRI , Tomohiro KIMURA , Yoshitaka YAMAMOTO
- 申请人地址: JP Osaka JP Atsugi-shi
- 专利权人: SHARP KABUSHIKI KAISHA,SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SHARP KABUSHIKI KAISHA,SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: JP Osaka JP Atsugi-shi
- 优先权: JP2011-116173 20110524
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L21/336
摘要:
An object is to reduce off-state leakage current between a source electrode and a drain electrode. One embodiment of the present invention is a semiconductor device including a gate electrode, gate insulating films and formed to cover the gate electrode, an active layer formed over the gate insulating films and located above the gate electrode, silicon layers and formed over side surfaces of the active layer and the gate insulating films, and a source electrode and a drain electrode formed over the silicon layers. The active layer is not in contact with each of the source electrode and the drain electrode.
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