Invention Application
US20120305859A1 LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE 审中-公开
低温可燃薄膜电镀膏

LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE
Abstract:
The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Ph-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
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