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公开(公告)号：US08790550B2
公开(公告)日：2014-07-29
申请号：US13472101
申请日：2012-05-15
Applicant: Kenneth Warren Hang , Hena Pyada , Howard T Sawhill , Michael A. Skurski , Robert Paul Waldrop
Inventor： Kenneth Warren Hang , Hena Pyada , Howard T Sawhill , Michael A. Skurski , Robert Paul Waldrop
Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
Abstract translation: 本发明涉及一种导电厚膜糊料组合物，其包含Ag和不含Pb的铋 - 氧化碲，两者分散在有机介质中，其中该糊剂可在低于420℃的温度下燃烧。该糊剂特别适用于形成电极 在诸如玻璃或薄膜，特别是电致变色玻璃或薄膜的基底上，会被更高的烧制温度损坏。 本发明进一步涉及包括由糊状组合物形成的电极的装置，特别涉及包括这种电极的电致变色装置。
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Patent Agency Ranking
公开(公告)号：US20120305858A1
公开(公告)日：2012-12-06
申请号：US13472101
申请日：2012-05-15
Applicant: KENNETH WARREN HANG , HENA PYADA , HOWARD T. SAWHILL , MICHAEL A. SKURSKI , ROBERT PAUL WALDROP
Inventor： KENNETH WARREN HANG , HENA PYADA , HOWARD T. SAWHILL , MICHAEL A. SKURSKI , ROBERT PAUL WALDROP
IPC: H01B1/02
Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
Abstract translation: 本发明涉及一种导电厚膜糊料组合物，其包含Ag和不含Pb的铋 - 氧化碲，两者分散在有机介质中，其中该糊剂可在低于420℃的温度下燃烧。该糊剂特别适用于形成电极 在诸如玻璃或薄膜，特别是电致变色玻璃或薄膜的基底上，会被更高的烧制温度损坏。 本发明进一步涉及包括由糊状组合物形成的电极的装置，特别涉及包括这种电极的电致变色装置。
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公开(公告)号：US20060254812A1
公开(公告)日：2006-11-16
申请号：US11486505
申请日：2006-07-14
Applicant: William Borland , Saul Ferguson , Hena Pyada
Inventor： William Borland , Saul Ferguson , Hena Pyada
CPC classification number: H05K1/162 , H05K3/061 , H05K3/429 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , Y10T29/43 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.
Abstract translation: 形成具有嵌入式厚膜电容器的印刷电路板的方法包括在蚀刻之前用保护涂层覆盖电容器层，以防止蚀刻溶液与电容器层接触并损坏电容器层，并直接在电容器电极和电路板电路之间形成通孔。
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4.发明申请Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards 有权厚膜电容器，在印刷电路板内嵌入厚膜电容器，以及形成这种电容器和印刷电路板的方法公开(公告)号：US20060002097A1
公开(公告)日：2006-01-05
申请号：US10882820
申请日：2004-07-01
Applicant: William Borland , Saul Ferguson , Hena Pyada
Inventor： William Borland , Saul Ferguson , Hena Pyada
CPC classification number: H05K1/162 , H05K3/061 , H05K3/429 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , Y10T29/417 , Y10T29/43 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
Abstract: A method of embedding thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from coming in contact with and damaging the capacitor layers.
Abstract translation: 嵌入厚膜电容器的方法包括在蚀刻之前覆盖具有保护涂层的电容器层，以防止蚀刻溶液与电容器层接触并损坏电容器层。
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公开(公告)号：US20120305859A1
公开(公告)日：2012-12-06
申请号：US13472182
申请日：2012-05-15
Applicant: Kenneth Warren Hang , Hena Pyada , Howard T. Sawhill , Michael A. Skurski , Robert Paul Waldrop
Inventor： Kenneth Warren Hang , Hena Pyada , Howard T. Sawhill , Michael A. Skurski , Robert Paul Waldrop
IPC: H01B1/22
Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Ph-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
Abstract translation: 本发明涉及一种导电厚膜糊料组合物，其包含分散在有机介质中的Ag和不含Ph的Bi基玻璃料，其中该糊料可在低于420℃的温度下燃烧。该糊剂特别适用于形成 诸如玻璃或薄膜，特别是电致变色玻璃或薄膜的基底上的电极将被较高的烧制温度损坏。 本发明进一步涉及包括由糊状组合物形成的电极的装置，特别涉及包括这种电极的电致变色装置。
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6.发明授权Methods of forming printed circuit boards having embedded thick film capacitors 有权形成具有嵌入式厚膜电容器的印刷电路板的方法公开(公告)号：US07100277B2
公开(公告)日：2006-09-05
申请号：US10882820
申请日：2004-07-01
Applicant: William J. Borland , Saul Ferguson , Hena Pyada
Inventor： William J. Borland , Saul Ferguson , Hena Pyada
CPC classification number: H05K1/162 , H05K3/061 , H05K3/429 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , Y10T29/417 , Y10T29/43 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.
Abstract translation: 形成具有嵌入式厚膜电容器的印刷电路板的方法包括在蚀刻之前用保护涂层覆盖电容器层，以防止蚀刻溶液与电容器层接触并损坏电容器层，并直接在电容器电极和电路板电路之间形成通孔。
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