发明申请
- 专利标题： Connector Design for Packaging Integrated Circuits
- 专利标题（中）： 封装集成电路连接器设计
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申请号： US13343582申请日： 2012-01-04
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公开(公告)号： US20120306073A1公开(公告)日： 2012-12-06
- 发明人: Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Cheng-Chieh Hsieh , Kuo-Ching Hsu , Ying-Ching Shih , Po-Hoa Tsai , Chin-Fu Kao , Cheng-Lin Huang , Jing-Cheng Lin
- 申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Cheng-Chieh Hsieh , Kuo-Ching Hsu , Ying-Ching Shih , Po-Hoa Tsai , Chin-Fu Kao , Cheng-Lin Huang , Jing-Cheng Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L21/768
摘要：
A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.
公开/授权文献
- US08664760B2 Connector design for packaging integrated circuits 公开/授权日：2014-03-04
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