发明申请
- 专利标题： Packaging Structures and Methods
- 专利标题（中）： 包装结构与方法
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申请号： US13298046申请日： 2011-11-16
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公开(公告)号： US20120306080A1公开(公告)日： 2012-12-06
- 发明人: Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
- 申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.
公开/授权文献
- US08610285B2 3D IC packaging structures and methods with a metal pillar 公开/授权日：2013-12-17