发明申请
- 专利标题： MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF, LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE
- 专利标题（中）： 安装基板及其制造方法，发光模块和照明装置
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申请号： US13582330申请日： 2011-04-27
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公开(公告)号： US20120320601A1公开(公告)日： 2012-12-20
- 发明人: Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
- 申请人： Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2010-111519 20100513; JP2010-114808 20100518; JP2010-114809 20100518; JP2010-114810 20100518
- 国际申请： PCT/JP2011/002492 WO 20110427
- 主分类号： H01L33/60
- IPC分类号： H01L33/60 ; B05D5/12 ; B32B17/06 ; B32B9/04 ; B32B18/00 ; B32B17/10
摘要：
An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass fit, and reflects light from the LED chips.
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