发明申请
- 专利标题: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- 专利标题(中): 半导体结构及其制造方法
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申请号: US13166091申请日: 2011-06-22
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公开(公告)号: US20120326261A1公开(公告)日: 2012-12-27
- 发明人: Wing-Chor Chan , Chung-Yu Hung , Chien-Wen Chu
- 申请人: Wing-Chor Chan , Chung-Yu Hung , Chien-Wen Chu
- 申请人地址: TW Hsinchu
- 专利权人: MACRONIX INTERNATIONAL CO., LTD.
- 当前专利权人: MACRONIX INTERNATIONAL CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L29/872
- IPC分类号: H01L29/872 ; H01L21/329
摘要:
A semiconductor structure and a manufacturing method for the same are provided. The semiconductor structure includes a well region, a dielectric structure, a first doped layer, a second doped layer and a first doped region. The dielectric structure is on the well region. The dielectric structure has a first dielectric sidewall and a second dielectric sidewall opposite to each other. The dielectric structure includes a first dielectric portion and a second dielectric portion, between the first dielectric sidewall and the second dielectric sidewall. The first doped layer is on the well region between the first dielectric portion and the second dielectric portion. The second doped layer is on the first doped layer. The first doped region is in the well region on the first dielectric sidewall.
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